Jiangsu Profile
Product List
12361. Laser Decapping Machine with Position Preview Function for Packaging & Testing Line 
[Aug 18, 2025]
[Aug 18, 2025] Product Description Product Features Position preview function,flexible setting of open cover shape, position and size Laser distance measurement with automatic focus,CCD video coaxial observation of laser ...
12362. Integrated Self-Developed Advanced Laser Internal Modification Machine for Sic / Si Wafer [Aug 18, 2025]
[Aug 18, 2025] Integrated Self-Developed Advanced Laser Internal Modification Machine for Sic / Si Wafer Product Description Laser Internal Modification Machine for SIC / Si wafer Equipment features: 1. Specially designed laser ...
12363. Laser Internal Modification Machine for Lt/Ln Wafer Compatible with 4/6 Inch Production [Aug 18, 2025]
[Aug 18, 2025] Laser Internal Modification Machine for Lt/Ln Wafer Compatible with 4/6 Inch Production Product Description Laser Internal modification machine for lt/ln wafer Equipment features: 1. Specially designed laser ...
12364. Automated Production Sic / Si Laser Wafer Internal Modification Machine [Aug 18, 2025]
[Aug 18, 2025] Product Description Laser Internal Modification Machine for SIC / Si wafer Equipment features: 1. Specially designed laser system 2. Excellent cutting effect 3. Fully automated production 4. High precision ...
12365. Customized High Efficiency Laser Trimming Machine for Circuit Board Industry Line Repair [Aug 18, 2025]
[Aug 18, 2025] Product Description Product Features Custom C02 or UV/Green picosecond laser Self-developed software and processing technology that meets different process requirements Glue removal and window opening Support ...
12366. Manufacture Laser Trimming Machine for LED, Mini LED Direct Display Module [Aug 18, 2025]
[Aug 18, 2025] Product Description Product Features Custom C02 or UV/Green picosecond laser Self-developed software and processing technology that meets different process requirements Glue removal and window opening Support ...
12367. Vp-10L Inline Vacuum Plasma Treatment System Machine with Inline Conveying System [Aug 15, 2025]
[Aug 15, 2025] Product Description Product features: 1. Adjustable - use electric amplitude modulation for the conveying mechanism, and the width can be adjusted arbitrarily; 2. Inline conveying system - used for communicating ...
12368. High Accuracy and Efficiency Wafer Dicing Machine for Semiconduction Equipment Processing [Jul 25, 2025]
[Jul 25, 2025] Product Description Wafer dicing machine for semiconductor equipment Wafer Dicing Machine The wafer dicing machine is primarily used for precision cutting of semiconductor wafers, integrated circuits, QFN packages, ...
12369. Continuous Automated Production Semiconductor Sic Composite Coating Vertical Furnace Integrated ... [Aug 14, 2025]
[Aug 14, 2025] Product Description Product Usage: This product is mainly oriented to the field of SIC power device manufacturing. The SIC/PI composite film is carbonized at 600-1050°C in a nitrogen atmosphere. During the ...
12370. Low-K/CMOS Wafer Laser Grooving Cutting Machine [Aug 14, 2025]
[Aug 14, 2025] Low-K/CMOS Wafer Laser Grooving Cutting Machine Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion platform. Equipped with special customized laser head, ...
12371. High-Precision Laser Trimming Automation Machine with Fully Automatic Loading / Unloading Mechanism [Aug 13, 2025]
[Aug 13, 2025] Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit functiontrimming . The high-precision laser trimming automation ...
12372. Fully Automatic Precision Laser Trimming Machine for Circuit Function Trimming [Aug 13, 2025]
[Aug 13, 2025] Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit function trimming . The high-precision laser trimming automation ...
12373. Precision Drilling/Cutting/Scribing Machine for Alumina/Aluminiumnitride/Zirconium ... [Aug 12, 2025]
[Aug 12, 2025] Product Description Product Features High peak power fiber laser.Stable and reliable. Long service life Laser waveform segmentation editing patented technology One machine for multiple applications of drilling, ...
12374. Semiconductor Industry Pi Curing Oxygen-Free Oven Machine for Flexible Circuit Board Printing [Aug 11, 2025]
[Aug 11, 2025] Product Description PI curing oxygen-free oven PI curing oxygen-free oven is used for special process requirements of PI, BCB, LCP curing and baking, photoresist curing, and electronic ceramic material drying. It is ...
12375. Factory Price Vacuum Packing Machine for Promotion [Aug 12, 2025]
[Aug 12, 2025] Product Description Factory Price Vacuum Packing Machine for Promotion Apply for the packaging of food, hardware and other particle in bulk such as electuary, spices,sugar, coffee,seeds and monosodium ...
