Jiangsu Profile
Product List
20911. High Precision Laser Cutting Machines for Solar Panel Production Equipment 
[Oct 21, 2026]
[Oct 21, 2026] Product Description Equipment Parameter Equipment Model HMLA03 Equipment Type Double head double light road Processing area 50x50mm-500x500mm Cut Method Cut head / vibrator Positioning ...
20912. Qt-8200 Professional Mixed Signal Tester for Accurate Electronic Measurements [Oct 21, 2026]
[Oct 21, 2026] Product Description QT-8200 Mixed Signal IC Test System (Hard-Docking) Product description: Application scope: power management; digital consumer; audio; automotive, energy saving and environmental friendly ...
20913. Advanced IC Board Cutting Tool for Professional Electronics Manufacturing [Oct 21, 2026]
[Oct 21, 2026] Product Description Product Features Staggered cutting with double stations for high efficiency Adopt telecentric lens, good cutting verticality Off-axis CCD automatic positioning system, high cutting ...
20914. High-Precision Laser Marking System with Intelligent Detection Features for Industrial Applications [Oct 21, 2026]
[Oct 21, 2026] Fully Automatic Substrate Laser Marking Equipment with Anti-Reverse Detection Product Description Product Features Flexible configuration of fiber lasers, green lasers, UV lasers, etc. High-precision digital ...
20915. Soap Plodder Extruder Bar Automatic Laundry Transparent Soap Making Machine for Sale [Sep 28, 2026]
[Sep 28, 2026] LAP100-B Soap Finishing Line Soap Plodder Extruder Bar Automatic Laundry Transparent Soap Making Machine for Sale The LAP100-B model is a small standard soap-making machine that uses oil as raw material. It is not only ...
Company: Nantong Sting Co., Ltd.
20916. Ultra Precision Picosecond Laser Cutter for Glass Artworks [Sep 28, 2026]
[Sep 28, 2026] High quality Ultra-Fast Pulsed Picosecond Laser Glass Cutting & Lobing Machine with High Peak Power Product Description Product Features Ultra-fast pulsed picosecond laser with high peak power, stable and ...
20917. Precision Laser Grooving Technology for Wafer Production Efficiency [Sep 28, 2026]
[Sep 28, 2026] High Quality Low-K Wafer Laser Grooving Equipment with Automatic Adjustment of Grooving Width Product Description Product Features 8/12 inch compatible Ultra-fast UV picro-second laser. Excellent process ...
20918. Precision Laser Cutting Machine with Customizable Laser Head for Industrial Applications [Oct 19, 2026]
[Oct 19, 2026] High Precision Laser Grooving Cutting Equipment with Special Customized Laser Head Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion ...
20919. Advanced Fully Automatic CMP Polisher for Wafer Cleaning and Processing [Oct 19, 2026]
[Oct 19, 2026] Product Description Fully Automatic CMP Polisher is designed for thin film (dielectric layer) processing, offering user-friendly operation and strong compatibility. By simply changing the polishing head, it can ...
20920. Rock Wool Acoustic Ceiling Panels Sound Absorbing Ceiling Board Material Stonewool Ceilings [Sep 27, 2026]
[Sep 27, 2026] DEGOFON Stonewool Acousticl Ceilings The Production process The base material of Degofon ceiling products is stone wool (resin bonded mineral wool) produced according to the principles of a volcanic eruption. By means ...
20921. Melamine Paper Making Machinery Industrial Composite Paper Board Production Line [Oct 15, 2026]
[Oct 15, 2026] Product Description Automatic Paper impregnation line Usage: Automatic Melamine Paper impregnation line main used to impregnated, gluing, dry ...
Company: Hallmark International Group Limited
20922. Advanced Dry-in/Dry-out Wafer Polishing Machine System for Precision CMP [Oct 15, 2026]
[Oct 15, 2026] Product Description Compatible with 6/8-inch wafers, fully automatic dry in and dry out, flexible process switching, and wide applicability Support the flattening process requirements of SiC, GaN third-generation ...
20923. Precision Eutectic Die Bonder for Next-Gen Wafer Bonding [Oct 15, 2026]
[Oct 15, 2026] Product Description High Precision Automatic Wafer Eclectic Bonder Die Bonder Bonding Machine Category Parameter Specification System Cycle time 230ms Performance X/Y placement ...
20924. Advanced Semiconductor Laser Annealing Equipment for Precise Processing [Oct 15, 2026]
[Oct 15, 2026] Product Description Product Features The first in China, 8 inch mass production equipment Precise energy density control UV laser with low penetration depth 1D top hat beam with large lengh/width ratio Low dopant ...
20925. High-Precision UV Laser Annealing Equipment for Bsi CCD Wafers [Oct 15, 2026]
[Oct 15, 2026] Product Description Product Features First domestic green laser machine for mass pruduction High reliability and stability Independly developped Optical system, LIET technology with IP Green/UV laser two ...
