Jiangsu Profile
Product List
22366. Innovative Drilling Technologies for Tough and Brittle Surfaces 
[Sep 02, 2026]
[Sep 02, 2026] Product Description Product Features Very high peak power laser which meets various precision processing hard-brittle materials Patented optical shaping technology for thin film applications (Min pore size of ...
22367. High-Precision Laser Drilling Machines for Zirconium and Alumina [Aug 31, 2026]
[Aug 31, 2026] Product Description Product Features High peak power fiber laser.Stable and reliable. Long service life Laser waveform segmentation editing patented technology One machine for multiple applications of drilling, ...
22368. Cutting-Edge Silicon Carbide Products to Enhance Manufacturing Output [Aug 31, 2026]
[Aug 31, 2026] Silicon Carbide High Temperature Splintering Furnace and Industrial Furnace industrial equipment Product Description Certification ISO Warranty 1 year Automatic ...
22369. Precision GaN Polishing Tools for Superior Sic Wafer Production [Aug 27, 2026]
[Aug 27, 2026] Product Description Meet all complex planarization process requirements in IC manufacturing. Suitable for mainstream 14nm/28nm logic processes, covering STI/ILD/IMD, FinFET/Metal gate/W/Cu and other processes. Product ...
22370. High-Precision IC Circuit Board Cutter for Enhanced Production [Aug 21, 2026]
[Aug 21, 2026] Product Description Product Features Staggered cutting with double stations for high efficiency Adopt telecentric lens, good cutting verticality Off-axis CCD automatic positioning system, high cutting ...
22371. High Precision Laser Cutting Machine with Custom Laser Head [Aug 21, 2026]
[Aug 21, 2026] High Precision Laser Grooving Cutting Equipment with Special Customized Laser Head Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion ...
22372. Advanced Qt-8200 Precision Mixed Signal Tester for Professionals and Experts [Aug 21, 2026]
[Aug 21, 2026] Product Description QT-8200 Mixed Signal IC Test System (Hard-Docking) Product description: Application scope: power management; digital consumer; audio; automotive, energy saving and environmental friendly ...
22373. Advanced Industrial Water Purification System for Superior Filtration [Aug 21, 2026]
[Aug 21, 2026] This DI water system: through the quartz sand activated carbon pretreatment system, and then through the first and second RO membrane reverse osmosis, and then through the EDI membrane stack, DI water is produced for ...
22374. Advanced Laser Cutting Machines for Efficient Solar Panel Manufacturing [Aug 21, 2026]
[Aug 21, 2026] Product Description Equipment Parameter Equipment Model HMLA03 Equipment Type Double head double light road Processing area 50x50mm-500x500mm Cut Method Cut head / vibrator Positioning ...
22375. Advanced High-Precision Laser Trimming Machine with Auto Loader [Aug 17, 2026]
[Aug 17, 2026] Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit functiontrimming . The high-precision laser trimming automation ...
22376. High Precision Eutectic Die Bonder for Wafer Bonding [Aug 17, 2026]
[Aug 17, 2026] Product Description High Precision Automatic Wafer Eclectic Bonder Die Bonder Bonding Machine Category Parameter Specification System Cycle time 230ms Performance X/Y placement accuracy ±10-25μm@3sigma Theta placement ...
22377. Advanced Oxygen-Free Curing Oven for Circuit Board Manufacturing [Aug 17, 2026]
[Aug 17, 2026] Product Description PI curing oxygen-free oven PI curing oxygen-free oven is used for special process requirements of PI, BCB, LCP curing and baking, photoresist curing, and electronic ceramic material drying. It is ...
22378. China Wholesale Ultra-Shallow Laser Annealing Equipment for Semiconductors [Aug 17, 2026]
[Aug 17, 2026] Product Description Product Features The first in China, 8 inch mass production equipment Precise energy density control UV laser with low penetration depth 1D top hat beam with large lengh/width ratio Low dopant ...
22379. High-Precision UV Laser Annealing System for Bsi-CCD Wafers [Aug 17, 2026]
[Aug 17, 2026] Product Description Product Features First domestic green laser machine for mass pruduction High reliability and stability Independly developped Optical system, LIET technology with IP Green/UV laser two ...
22380. Precision Eutectic Die Bonder for High-Performance Semiconductor Assembly [Aug 17, 2026]
[Aug 17, 2026] Product Description Category Sub - Category Parameter Chip Application COC Chip size 0.15mm< Chip size ≤1.5mm Substrate size 0.15mm≤ Substrate size ≤4mm Velocity Production cycle (1 ...
