Jiangsu Profile
Product List
9121. High Quality ISO Approved High Speed PCB Module Laser Cutting Machine 
[Jul 22, 2025]
[Jul 22, 2025] High Quality ISO Approved High Speed PCB Module Laser Cutting Machine Product Description Product Features Staggered cutting with double stations for high efficiency Adopt telecentric lens, good cutting verticality ...
9122. Dqx Series Radio Frequency Plasma Cleaning Machine [Jul 22, 2025]
[Jul 22, 2025] Dqx Series Radio Frequency Plasma Cleaning Machine Product Description The principle of plasma cleaning is to from high frequency alternating electrodes in vacuum condition, so that the gas in this area will from ...
9123. High Quality Fully Automatic Semiconductor Equipment Die Bonding Machine [Jul 22, 2025]
[Jul 22, 2025] High Precision Semiconductor Equipment Die Bonding Machine Fully Automatic Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach ...
9124. Sic UV Laser Annealing Machine for Bsi-CCD Wafer Precise Energy Density Control [Jul 22, 2025]
[Jul 22, 2025] Sic UV Laser Annealing Machine for Bsi-CCD Wafer Precise Energy Density Control Product Description Product Features First domestic green laser machine for mass pruduction High reliability and ...
9125. High Quality Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot [Jul 22, 2025]
[Jul 22, 2025] High Quality Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot Product Description Equipment Advantage Equipped with material information scanning and input system Equipped wtith wafer level ...
9126. High Quality Sic UV Laser Annealing Machine for Bsi-CCD Wafer [Jul 22, 2025]
[Jul 22, 2025] High Quality Sic UV Laser Annealing Machine for Bsi-CCD Wafer Product Description Product Features First domestic green laser machine for mass pruduction High reliability and stability Independly developped ...
9127. High Quality Fully Automatic Soft Solder Die Bonding Machine Factory [Jul 22, 2025]
[Jul 22, 2025] High Quality Fully Automatic Soft Solder Die Bonding Machine Factory Product Description This equipment is a soft solder die bonder designed for thermal die bonding of TO power devices. This equipment is a new ...
9128. High Quality 12inch Fully Automatic Soft Solder Die Bonding Machine [Jul 22, 2025]
[Jul 22, 2025] High Quality 12inch Fully automatic soft solder die bonding machine Product Description This equipment is a soft solder die bonder designed for thermal die bonding of TO power devices. This equipment is a new ...
9129. Automatic Laser Cutting Machine for Circuit Boards, Packaging IC Carrierboard Precision Cutting [Jul 22, 2025]
[Jul 22, 2025] Product Description Product Features Select laser, fixture and stage according to actual product processing needs One machine for drilling, cutting and scribing, reducing customer costs Support full cutting / half ...
9130. Ceramic Laser Drilling/Dicing Machine with Multi-Feature CCD Visual Positioning [Jul 22, 2025]
[Jul 22, 2025] Product Description Product Features High peak power fiber laser.Stable and reliable. Long service life Laser waveform segmentation editing patented technology One machine for multiple applications of drilling, cutting ...
9131. China Wholesale Ultra-Shallow Dopant Laser Annealing Machine for Bsi-CCD Wafer [Jul 22, 2025]
[Jul 22, 2025] Product Description Product Features The first in China, 8 inch mass production equipment Precise energy density control UV laser with low penetration depth 1D top hat beam with large lengh/width ratio Low dopant ...
9132. Automatic Loading and Unloading Wafer Bonder Machine with Remote Online Diagnostics [Jul 22, 2025]
[Jul 22, 2025] Product Description Exhibition & Customers Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is ...
9133. Ceramic Laser Drilling/Automatic Dicing Saw Machine with CCD Visual Positioning [Jul 22, 2025]
[Jul 22, 2025] Product Description Product Features High peak power fiber laser.Stable and reliable. Long service life Laser waveform segmentation editing patented technology One machine for multiple applications of drilling, ...
9134. Laser Precision Cutting Machine with Multi-Feature CCD Visual Positioning [Jul 22, 2025]
[Jul 22, 2025] Product Description Product Features Select laser, fixture and stage according to actual product processing needs One machine for drilling, cutting and scribing, reducing customer costs Support full cutting / half ...
9135. Customization Silicon Carbide Wafer Laser Processing Machine Factory [Jul 17, 2025]
[Jul 17, 2025] Customization Silicon Carbide Wafer Laser Processing machine factory Product Description Standard Features Computer Control, Windows OS CCD visual positioning system Servo Motor UPS and voltage stabilizer ESD ...
