Jiangsu Profile
Product List
8146. 220L Steel Oil Drum Automatic Logo Printing Machine 
[Feb 27, 2026]
[Feb 27, 2026] Automatic Steel Drum Screen Printing Machine for 200L Oil Drum Logo Printing The purpose of this screen printing machine is to print text and patterns on the outer surface of steel drums, meeting customer requirements ...
8147. High-Precision SMT Red Glue Dispensing Machine for Electronics Assembly [Mar 02, 2026]
[Mar 02, 2026] High Precision Automatic SMT Red Glue Dispensing Equipment Standard Features Computer Control, Windows OS CCD visual positioning system Servo Motor UPS and voltage stabilizer ESD grounding point- CE certifed ...
8148. Precision Laser Cutting Machine for PCB and Flexible Circuits [Feb 28, 2026]
[Feb 28, 2026] Laser Cutting Machine for PCB Printed Circuit Board Flex PCB Laser Cutting Product Description Product Features Select laser, fixture and stage according to actual product processing needs One machine for drilling, ...
8149. Subsurface Laser Modification and Precision Dicing Machine for Semiconductor Wafers Sic/GaN/Ln/Lt [Feb 28, 2026]
[Feb 28, 2026] Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...
8150. Sic GaN Wafer Laser Dicing Machine for Semiconductor Manufacturing [Feb 28, 2026]
[Feb 28, 2026] Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...
8151. Advanced Precision Laser Cutting Machine with Real-Time Feedback [Feb 28, 2026]
[Feb 28, 2026] Product Description MPS-3015C series super families for sheet metal processing industry tailored double drive Longmen interactive fiber laser cutting equipment. It has the advantages of stable performance, high ...
8152. Precision Desktop Liquid Gluing Dispensing System Potting Machine for Industrial Use [Feb 28, 2026]
[Feb 28, 2026] Industrial Dispensing machine Desktop Robot Glue coating Dispenser device producer Product Description Specifications TSV-200D HSV-200D Dimension (mm) L1120×W740×H760 ...
8153. Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot [Feb 28, 2026]
[Feb 28, 2026] Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot Product Description Equipment Advantage Equipped with material information scanning and input system Equipped wtith wafer level handling ...
8154. Automatic High Speed Epoxy Die Bonder Machine Manufacturer [Feb 28, 2026]
[Feb 28, 2026] Fully Automatic Die Bonding Machine System manufacturer Product Description Ultra High-Speed Silver Paste Die Bonder Unmatched Speed and Precision for Modern Semiconductor Assembly Introducing our fully automatic ...
8155. Advanced Automatic Laser Drilling Machine for Glass and Ceramics [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features Very high peak power laser which meets various precision processing hard-brittle materials Patented optical shaping technology for thin film applications (Min pore size of ...
8156. Advanced Customizable Laser Grooving Cutting Machine for Precision Work [Feb 28, 2026]
[Feb 28, 2026] High Quality Laser Grooving Cutting Equipment Equipped with Special Customized Laser Head Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion ...
8157. Advanced Fully Automatic Desktop Dispensing Machine for Precision Production [Feb 28, 2026]
[Feb 28, 2026] High-Precision Desktop Dispensing Machine Fully Automatic Product Description Standard Features Computer Control, Windows OS CCD visual positioning system Servo Motor UPS and voltage stabilizer ESD grounding ...
8158. Automatic LED/IC Flip Chip Die Bonding Machine [Feb 28, 2026]
[Feb 28, 2026] HMLA-S platform is an off-line automatic micro assembly system developed by the company, which can be equipped with nozzle heating module, material tray/wafer placing plate, ultrasonic module, laser heating module, UV ...
8159. Wire Bonding Machine for Semiconductor Production [Feb 28, 2026]
[Feb 28, 2026] Product Description Maximize Output, Minimize Downtime: The H580PLUS Automatic Wire Bonder The Himalaya H580PLUS is a high-performance, fully automatic, vertical injection molding machine designed for mass production. ...
8160. Scaffold Pole Welding Can Be Easily Completed Scaffolding Standard Welding Machine of a ... [Dec 26, 2025]
[Dec 26, 2025] Welcome to CONCELA About CONCELA Founded in 2015, Suzhou Concela Automation is located in Suzhou Xiangcheng Economic Development Zone, No. 777, Kangyuan Road, 4 kilometers away from Suzhou North High-speed Railway ...
