Jiangsu Profile
Product List
139486. Advanced Electroplating Cleaning Machine for Precision Metal Finishing 
[Feb 28, 2026]
[Feb 28, 2026] High-Quality Electroplating Cleaning Machine for Electroplating, Plating, Oxidation, Etching and Cleaning Product Description 1,Scope of application Small integrated wastewater treatment equipment, small integrated ...
139487. Professional 355nm UV Laser Engraving Machine for Quality Results [Feb 28, 2026]
[Feb 28, 2026] UV laser marking system The UV laser marking system is characterized by its small size, low power consumption, long lifespan, high efficiency, and maintenance - free operation. It is convenient to install and carry. The ...
139488. Automatic Glue Dispenser Machine Three-Axis Desktop Dispensing Robot Vision Glue Dispensing Machine [Feb 28, 2026]
[Feb 28, 2026] Product Description Standard Features Computer Control, Windows OS CCD visual positioning system Servo Motor UPS and voltage stabilizer ESD grounding point- CE certifed Optional Features Automatic constant ...
139489. High Precision UV Laser Cutting Machine for Wafer Processing [Feb 28, 2026]
[Feb 28, 2026] High Precision UV Laser Marking Cutting Machine for Wafers Cutting Processing Product Description Brief Description Applicable for the 2 inch, 4 inch, 8 inch and 12 inch wafers cutting ...
139490. Automated Microchip Dispensing Machines for Efficient Manufacturing Lines [Feb 28, 2026]
[Feb 28, 2026] Product Description This device is used for micro assembly, dispensing, and surface mounting processes. It has the characteristics of multi threading, multi timing, flexible process combination, complex logic and ...
139491. Advanced Fully Automatic Laser Marking Machine for Wafer ID [Feb 28, 2026]
[Feb 28, 2026] Fully Automatic Wafer ID Laser Marking Machine Product Description 1. Applied to semiconductor wafer ID marking, compatible with products under 12 inches; 2. Fully automatic operation, equipped with FFU ...
139492. Advanced Sic UV Laser Annealing Machine for Bsi-CCD Wafers [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features First domestic green laser machine for mass pruduction High reliability and stability Independly developped Optical system, LIET technology with IP Green/UV laser two wavelengths are ...
139493. Smema Compliant Hdz-PCB100: Fully Automatic Inline PCB Laser Marking Machine [Feb 28, 2026]
[Feb 28, 2026] Product Description Maximize PCB Traceability & Efficiency with the LASER PCB100 Laser Marking Machine In the precise world of printed circuit board (PCB) manufacturing, every detail matters-especially permanent, ...
139494. 30W Automatic UV Picosecond Laser Cutting Machine for Sapphire Glass FPC [Feb 28, 2026]
[Feb 28, 2026] Product Description Revolutionize Precision Cutting with Our Fully Automated UV Picosecond Laser System Our state-of-the-art Ultraviolet Picosecond Laser Cutting Machine is engineered for high-precision, automated ...
139495. Jewelry Fiber Laser Engraving Marking Machine with System Easy to 3D Processing [Feb 28, 2026]
[Feb 28, 2026] Jewelry Fiber Laser Engraving Marking Machine with System Easy to 3D Processing Product Description Brief Description The YLP-MDF-152 laser marker is mainly applied on the sample which is not flat, such as column, ...
139496. High Precision Automatic Wafer Eutectic Bonder Die Bonder Bonding Machine [Feb 28, 2026]
[Feb 28, 2026] Product Description High Precision Automatic Wafer Eclectic Bonder Die Bonder Bonding Machine Category Parameter Specification System Cycle time 230ms Performance X/Y placement ...
139497. Single Chip Cleaning/Scrubbing Machine for Wafer Corrosion Cleaning [Feb 28, 2026]
[Feb 28, 2026] Single Chip Cleaning/Scrubbing Machine for Wafer Corrosion Cleaning Product Description SQX series Manual cleaning machine SQX series manual cleaning machine is designed as a kind of manual operating wet ...
139498. Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms [Feb 28, 2026]
[Feb 28, 2026] Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms This machine is a specialized equipment for semiconductor wafer Laser Grooving, designed as a fully automatic model, and adopts ...
139499. Projection Lithography Machine Suitable for Packaging Micro LED Mems [Feb 28, 2026]
[Feb 28, 2026] Product Description MPS-02 Projection lithography Product advantages 1.High yield 2.Modular design 3.High reliability 4.Suitable for packaging MicroLED MEMS and other processes Wafer Size 200mm Wafer(300mm ...
139500. High Precision 15W UV Laser Wafer Dicing Machine for Efficient Cutting [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Overview The KY-C-UC15-P3040 is a high-precision UV laser processing system designed for cutting and dicing wafers up to 6 inches in diameter. Utilizing a DPSS ultraviolet laser source ...
