Jiangsu Profile
Product List
108646. Wheel Head Moving Surface Machine M7130 
[Mar 05, 2019]
[Mar 05, 2019] 1. Picture 2. Parameters Parameters Unit M7130 Size of Worktable(L×W×H) mm 1000×300×400 Max.Longitudinal Movement of Worktable mm 1100 Max.Distance from the Spindle Centerline to ...
Company: NANTONG KAITE MACHINE TOOL CO., LTD.
108647. M7130/M7140 Wheel Head Moving Surface Grinding Machine [Mar 05, 2019]
[Mar 05, 2019] 1. Picture 2. Parameters Parameters Unit M7130 M7140 Size of ...
Company: NANTONG KAITE MACHINE TOOL CO., LTD.
108648. M7130/7140 Hydraulic Cyliner Head Surface Grinding Machine Price List [Mar 05, 2019]
[Mar 05, 2019] 1. Picture 2. Parameters Parameters Unit M7130 M7140 Size of Worktable(L×W×H) mm 1000×300×400 1000×400×400 Max.Longitudinal Movement of ...
Company: NANTONG KAITE MACHINE TOOL CO., LTD.
108649. M71 Series Conventional Surface Grinding Machine [Mar 05, 2019]
[Mar 05, 2019] 1. Picture 2. Parameters Parameters Unit M7130 M7140 Size of Worktable(L×W×H) mm 1000×300×400 1000×400×400 Max.Longitudinal Movement of ...
Company: NANTONG KAITE MACHINE TOOL CO., LTD.
108650. M250-200X460mm Manual Surface Grinding Machine [Mar 04, 2019]
[Mar 04, 2019] 1. Picture 2. Parameters Parameters Unit M250 Working Surface of Table mm 200×460 (8"×18") Max.Table Travel mm 540 Max.Cross Travel mm 240 Distance Between Table Surface and Spindle ...
Company: NANTONG KAITE MACHINE TOOL CO., LTD.
108651. M Series Manual Saddle Moving Surface Grinder Machine [May 08, 2018]
[May 08, 2018] 1. Picture 2. Parameters Parameters Unit M250 Working Surface of Table mm 200×460 (8"×18") Max.Table Travel mm 540 Max.Cross Travel mm 240 Distance Between Table Surface and Spindle ...
Company: NANTONG KAITE MACHINE TOOL CO., LTD.
108652. M618 Manual Metal Grinding Machinery [May 08, 2018]
[May 08, 2018] 1. Picture 2. Parameters Parameters Unit M618 Working Surface of Table mm 150×450 (5.9"×17.7") Max.Table Travel mm 480 Max.Cross Travel mm 165 Distance Between Table Surface and ...
Company: NANTONG KAITE MACHINE TOOL CO., LTD.
108653. M618 Small Surface Grinding Machine for Metal Polishing [May 08, 2018]
[May 08, 2018] 1. Picture 2. Parameters Parameters Unit M618 Working Surface of Table mm 150×450 (5.9"×17.7") Max.Table Travel mm 480 Max.Cross Travel mm 165 Distance Between Table Surface and ...
Company: NANTONG KAITE MACHINE TOOL CO., LTD.
108654. Mini 150X450mm M618 Surface Grinder [May 08, 2018]
[May 08, 2018] 1. Picture 2. Parameters Parameters Unit M618 Working Surface of Table mm 150×450 (5.9"×17.7") Max.Table Travel mm 480 Max.Cross Travel mm 165 Distance Between Table Surface and ...
Company: NANTONG KAITE MACHINE TOOL CO., LTD.
108655. Silicon Wafer Double Side Grinding Machine for IC Wafer [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
108656. Semiconductor Wafer Double Side Polishing Machine [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
108657. IC Silicon Wafer Thinning Machine High Precision [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
108658. Semiconductor Silicon Wafer Double Side Grinding Equipment [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
108659. Silicon Wafer Thinning Machine for Microelectronics [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
108660. Semiconductor Wafer Double Side Lapping Equipment [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
