Jiangsu Profile
Product List
5521. CNC H Beam Laser Cutting Drilling Machine for Structural Steel Processing Line 
[Feb 02, 2026]
[Feb 02, 2026] Product Parameters Model ZX-FCX50120 Profile Steel Cutting Range Height:150mm~800mm Width:250mm~1200mm Length<= 26000mm X-Axis Travel 2000mm Y-Axis Travel 26000mm Z-Axis Travel 900mm X/Y Axis ...
Company: Wuxi Zhouxiang Complete Set of Welding Equipment Co., Ltd.
5522. Professional 355nm UV Laser Engraving Machine for Quality Results [Feb 28, 2026]
[Feb 28, 2026] UV laser marking system The UV laser marking system is characterized by its small size, low power consumption, long lifespan, high efficiency, and maintenance - free operation. It is convenient to install and carry. The ...
5523. High Precision UV Laser Cutting Machine for Wafer Processing [Feb 28, 2026]
[Feb 28, 2026] High Precision UV Laser Marking Cutting Machine for Wafers Cutting Processing Product Description Brief Description Applicable for the 2 inch, 4 inch, 8 inch and 12 inch wafers cutting ...
5524. Advanced High-Precision Laser Marking Machine with Smart Detection [Feb 28, 2026]
[Feb 28, 2026] Fully Automatic Substrate Laser Marking Equipment with Anti-Reverse Detection Product Description Product Features Flexible configuration of fiber lasers, green lasers, UV lasers, etc. High-precision digital ...
5525. High-Precision 355nm 3W UV Laser Engraving Machine with Safety Features [Feb 28, 2026]
[Feb 28, 2026] Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole ...
5526. Advanced Fully Automatic Laser Marking Machine for Wafer ID [Feb 28, 2026]
[Feb 28, 2026] Fully Automatic Wafer ID Laser Marking Machine Product Description 1. Applied to semiconductor wafer ID marking, compatible with products under 12 inches; 2. Fully automatic operation, equipped with FFU ...
5527. Advanced Sic UV Laser Annealing Machine for Bsi-CCD Wafers [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features First domestic green laser machine for mass pruduction High reliability and stability Independly developped Optical system, LIET technology with IP Green/UV laser two wavelengths are ...
5528. Smema Compliant Hdz-PCB100: Fully Automatic Inline PCB Laser Marking Machine [Feb 28, 2026]
[Feb 28, 2026] Product Description Maximize PCB Traceability & Efficiency with the LASER PCB100 Laser Marking Machine In the precise world of printed circuit board (PCB) manufacturing, every detail matters-especially permanent, ...
5529. 355nm UV Laser Depaneling Machine: 20μM Precision Cutting for PCB [Feb 28, 2026]
[Feb 28, 2026] Product Description 355nm UV Laser Cutting Machine Laser depaneling machine for PCB and related industry. Utilizing a high-performance UV laser, it minimizes the heat-affected zone for high-density PCBA products. ...
5530. 30W Automatic UV Picosecond Laser Cutting Machine for Sapphire Glass FPC [Feb 28, 2026]
[Feb 28, 2026] Product Description Revolutionize Precision Cutting with Our Fully Automated UV Picosecond Laser System Our state-of-the-art Ultraviolet Picosecond Laser Cutting Machine is engineered for high-precision, automated ...
5531. High-Precision Fiber Laser Marking Machine for Packaging Solutions [Feb 28, 2026]
[Feb 28, 2026] Online Flying Fiber Laser Marking Machine for Flexible Packaging Films Product Description Brief Description CO2 series products are mainly applicable to non-metallic materials of high-speed flight marking, such as ...
5532. Jewelry Fiber Laser Engraving Marking Machine with System Easy to 3D Processing [Feb 28, 2026]
[Feb 28, 2026] Jewelry Fiber Laser Engraving Marking Machine with System Easy to 3D Processing Product Description Brief Description The YLP-MDF-152 laser marker is mainly applied on the sample which is not flat, such as column, ...
5533. Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms [Feb 28, 2026]
[Feb 28, 2026] Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms This machine is a specialized equipment for semiconductor wafer Laser Grooving, designed as a fully automatic model, and adopts ...
5534. High-Precision Automatic CCD UV Laser Marking Machine for Ics and Pcbs [Feb 28, 2026]
[Feb 28, 2026] Fully Automatic 8-12 Inches Wafer Marking Equipment with a Crystal Loading System Product Description Wafer Marking 1. Product compatible size: 8-12 inch ring crystal cage; 2. Equipped with a crystal loading system that ...
5535. High Precision 15W UV Laser Wafer Dicing Machine for Efficient Cutting [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Overview The KY-C-UC15-P3040 is a high-precision UV laser processing system designed for cutting and dicing wafers up to 6 inches in diameter. Utilizing a DPSS ultraviolet laser source ...
