Jiangsu Profile
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Product List
12316. Material Tote Handling Carton Box Picking Transfer Agv AMR Mobile Robot 
[Dec 19, 2025]
[Dec 19, 2025] Carton Transfer Unit (CTU)---Clamping C Series Supports different types and sizes of carriers such as standard totes, cartons, etc., adapting to typical circulation logistics and warehousing applications, covering 0.3m ...
12317. Material Box Handling Tote Clamping Carton Transport Logistics Agv AMR Mobile Robot [Dec 19, 2025]
[Dec 19, 2025] Carton Transfer Unit (CTU)---Clamping C Series Supports different types and sizes of carriers such as standard totes, cartons, etc., adapting to typical circulation logistics and warehousing applications, covering 0.3m ...
12318. 1500kg Loading Capacity Material Handling Warehouse Agv Mobile Robot [Dec 19, 2025]
[Dec 19, 2025] Forklift Mobile Robot Stacking Series Stacking series FMRs cover the load ranging from 1,000kg to 3,000kg, with the highest lifting height being customized up to 4.5m. The specially designed thickness of the FMR body ...
12319. 1000kg Capacity Warehouse Agv Stacking Warehousing Robot AMR [Dec 19, 2025]
[Dec 19, 2025] Forklift Mobile Robot Stacking Series Stacking series FMRs cover the load ranging from 1,000kg to 3,000kg, with the highest lifting height being customized up to 4.5m. The specially designed thickness of the FMR body ...
12320. Environmentally-Friendly Wire Cutting Tools EDM Dk7750 for Precision Processing of Mechanical ... [Dec 19, 2025]
[Dec 19, 2025] Product Description PERFORMANCE An EDM Wire Cutting Machine, also known as Wire Electrical Discharge Machining, is a precision machining technology that utilizes controlled electrical sparks to cut complex shapes and ...
Company: Supertech Machine Tool Co., Ltd.
12321. High Precision UV Laser Cutting Machine for Wafer Processing [Dec 13, 2025]
[Dec 13, 2025] High Precision UV Laser Marking Cutting Machine for Wafers Cutting Processing Product Description Brief Description Applicable for the 2 inch, 4 inch, 8 inch and 12 inch wafers cutting ...
12322. High-Precision CO2 Laser Engraving Machine for Wood and Plastic [Dec 13, 2025]
[Dec 13, 2025] Product Description It can be widely used in graphic marks on craft gifts, clothing leather, wood paper, food packaging, FPC, ceramics, semiconductors, crystal glass, plastic parts, silicone rubber products and other ...
12323. High-Precision UV Laser Marking Machine for Metal and Plastic [Dec 13, 2025]
[Dec 13, 2025] UV Laser Marking Machine on Metal Glass Cup Plastic Rubber Leather Water Bottle Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking of food, ...
12324. Jewelry Fiber Laser Engraving Marking Machine with System Easy to 3D Processing [Dec 13, 2025]
[Dec 13, 2025] Jewelry Fiber Laser Engraving Marking Machine with System Easy to 3D Processing Product Description Brief Description The YLP-MDF-152 laser marker is mainly applied on the sample which is not flat, such as column, ...
12325. High-Precision Online Fiber Laser Marking Machine for Packaging [Dec 13, 2025]
[Dec 13, 2025] Online Flying Fiber Laser Marking Machine for Flexible Packaging Films Product Description Brief Description CO2 series products are mainly applicable to non-metallic materials of high-speed flight marking, such as ...
12326. Advanced Fully Automatic Laser Marking Machine for Wafer ID [Dec 13, 2025]
[Dec 13, 2025] Fully Automatic Wafer ID Laser Marking Machine Product Description 1. Applied to semiconductor wafer ID marking, compatible with products under 12 inches; 2. Fully automatic operation, equipped with FFU ...
12327. Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms [Dec 13, 2025]
[Dec 13, 2025] Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms This machine is a specialized equipment for semiconductor wafer Laser Grooving, designed as a fully automatic model, and adopts ...
12328. High-Precision Automatic CCD UV Laser Marking Machine for Ics and Pcbs [Dec 13, 2025]
[Dec 13, 2025] Fully Automatic 8-12 Inches Wafer Marking Equipment with a Crystal Loading System Product Description Wafer Marking 1. Product compatible size: 8-12 inch ring crystal cage; 2. Equipped with a crystal loading system that ...
12329. High Precision 15W UV Laser Wafer Dicing Machine for Efficient Cutting [Dec 13, 2025]
[Dec 13, 2025] Product Description Product Overview The KY-C-UC15-P3040 is a high-precision UV laser processing system designed for cutting and dicing wafers up to 6 inches in diameter. Utilizing a DPSS ultraviolet laser source ...
12330. High-Precision Laser Cutting Machine with Advanced CCD Positioning [Dec 13, 2025]
[Dec 13, 2025] Product Description Product Features Select laser, fixture and stage according to actual product processing needs One machine for drilling, cutting and scribing, reducing customer costs Support full cutting / ...
