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Advanced Laser Stealth Dicing/Cutting Equipment for Semiconductor Wafers
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49156.

Advanced Laser Stealth Dicing/Cutting Equipment for Semiconductor Wafers Open Details in New Window [Feb 28, 2026]

Product Description Complete SiC (Silicon Carbide) Wafer Laser Cutting Solution This integrated solution is engineered for high-precision, high-efficiency, and high-yield processing of brittle silicon carbide materials. ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Performance Sic Laser Annealing System for Wafer Efficiency
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49157.

High-Performance Sic Laser Annealing System for Wafer Efficiency Open Details in New Window [Feb 28, 2026]

Product Description Product Features First domestic green laser machine for mass pruduction High reliability and stability Independly developped Optical system, LIET technology with IP Green/UV laser two wavelengths are ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Precision Laser Resistor Trimming Automation System Solution (HTS900 Series)
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49158.

High Precision Laser Resistor Trimming Automation System Solution (HTS900 Series) Open Details in New Window [Feb 28, 2026]

Product Description Laser resistor trimming is the mainstream process of resistor trimming , which has the highest precision and efficiency , and can complete the functiontrimming of the circuit . The high-precision ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Sic UV Laser Annealing Machine for Bsi-CCD Wafers
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49159.

Advanced Sic UV Laser Annealing Machine for Bsi-CCD Wafers Open Details in New Window [Feb 28, 2026]

Product Description Product Features First domestic green laser machine for mass pruduction High reliability and stability Independly developped Optical system, LIET technology with IP Green/UV laser two wavelengths are ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

China Wholesale Ultra-Shallow Dopant Laser Annealing Equipment for Semiconductor Machine Bsi-CCD ...
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49160.

China Wholesale Ultra-Shallow Dopant Laser Annealing Equipment for Semiconductor Machine Bsi-CCD ... Open Details in New Window [Feb 28, 2026]

Product Description Product Features The first in China, 8 inch mass production equipment Precise energy density control UV laser with low penetration depth 1D top hat beam with large lengh/width ratio Low dopant ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Ultra-Shallow UV Dopant Laser Annealing Equipment for Bsi-CCD & Sic Wafers
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49161.

Advanced Ultra-Shallow UV Dopant Laser Annealing Equipment for Bsi-CCD & Sic Wafers Open Details in New Window [Feb 28, 2026]

Premium-Grade Sic UV Laser Annealing Machine for BSI-CCD Wafers Product Description Shallow Dopant Laser Annealing for BSI-CCD and Advanced Semiconductors In the relentless pursuit of smaller, faster, and more ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Prototype CNC Parts Precision CNC Machining Service 5-Axis Machining Laser Cutting CNC Machining ...
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49162.

Prototype CNC Parts Precision CNC Machining Service 5-Axis Machining Laser Cutting CNC Machining ... Open Details in New Window [May 26, 2026]

Products CNC Machining part Materials Aluminum, Brass, Bronze, Copper, Hardened Metals, Precious Metals, Stainless Steel, Steel Alloys,ti, etc; Dimensions According to customer’s drawing; Surface treatment Heat ...

Company: Suzhou Everich Industrial Tech Co., Ltd

High-Power 3000W/6000W Metal Tube Laser Cutting Machine – Precision & Speed
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49163.

High-Power 3000W/6000W Metal Tube Laser Cutting Machine – Precision & Speed Open Details in New Window [Mar 20, 2026]

Technical Specifications Material Thickness Speed(m/min) Gas Carbon Steel 1 50-55 N2 2 25-31 3 15-20 4 8-10 5 6-7 6 5-6 8 2.2-2.7 O2 10 2.0-2.4 12 1.8-2.1 14 1.4-1.7 16 0.9-1.2 18 0.7-1 20 0.6-0.8 22 0.55-0.65 Stainless ...

Company: Jiangsu Goldsun Winwin Global Trade Co., Ltd.

High-Precision CO2 Laser Machine for Ceramic Marking and Engraving
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49164.

High-Precision CO2 Laser Machine for Ceramic Marking and Engraving Open Details in New Window [Mar 10, 2026]

Product Description Laser Cutting System Technical Specifications & Advantages Aviation-grade cast aluminum crossbeam Annealing + vibration aging + precision machining | - High rigidity & stability Ultra-tight ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

CNC Laser Cutting Machining Service Fabrication Sheet Aluminium Stainless Steel Brass Parts
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49165.

CNC Laser Cutting Machining Service Fabrication Sheet Aluminium Stainless Steel Brass Parts Open Details in New Window [Feb 28, 2026]

Custom Cnc Laser Cutting Machining Service Fabrication Sheet Metal Aluminium Stainless Steel Brass Parts Product Description Material Stainless steel,Brass, Copper, Carbon steel,Aluminum,alloy ,zinc ...

Company: Wuxi Ingks Metal Parts Co., Ltd.

Panel2116e CNC Control Panel Ethercat Industrial Control Panel Codesys Laser Machine Profibus Fanuc ...
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49166.

Panel2116e CNC Control Panel Ethercat Industrial Control Panel Codesys Laser Machine Profibus Fanuc ... Open Details in New Window [Feb 11, 2025]

· Panel:Aluminium-magnesium alloy,Rear:platemetal · Front panel/Rear:IP65 / IP20 · Support EtherCAT and Modbus-TCP protocol · Max. supported 98 keys & 98 LEDs,no need any I/O modules ...

Company: Panelmate Intelligent Equipment (Jiangsu) Co., Ltd.

Sic Laser Annealing Semiconductor Equipment Equipped with Efem Transmission System
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49167.

Sic Laser Annealing Semiconductor Equipment Equipped with Efem Transmission System Open Details in New Window [Apr 02, 2026]

Product Description Laser Annealing Machine for Sic Equipment features: 1. Modular design and integration of the entire machine, compatible with 4, 6, and 8-inch thin chip wafers 2. Integrated self-developed advanced ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

SA-2000-P2 6 mm2 Automatic Ferrules Insulated Molex Jst Te Terminal Crimping Machine Shrink Tube ...
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49168.

SA-2000-P2 6 mm2 Automatic Ferrules Insulated Molex Jst Te Terminal Crimping Machine Shrink Tube ... Open Details in New Window [Jun 01, 2026]

Product Description SA-2000-P2 This is Automatic Wire Crimping and Shrink Tube Marking Inserting Machine,the machine is automatic wire cutting stripping ,double end crimping and shrink tube marking and inserting all in ...

Company: Suzhou Sanao Electronic Equipment Co., Ltd.

Industrial Metal Tube Laser Cutter – 3000W & 6000W Options for High-Speed Cutting
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49169.

Industrial Metal Tube Laser Cutter – 3000W & 6000W Options for High-Speed Cutting Open Details in New Window [Mar 02, 2026]

Technical Specifications Material Thickness Speed(m/min) Gas Carbon Steel 1 50-55 N2 2 25-31 3 15-20 4 8-10 5 6-7 6 5-6 8 2.2-2.7 ...

Company: Jiangsu Goldsun Winwin Global Trade Co., Ltd.

6 to 8 Inch Sic Laser Annealing Equipment with Fully Autonomous Optical System
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49170.

6 to 8 Inch Sic Laser Annealing Equipment with Fully Autonomous Optical System Open Details in New Window [Feb 28, 2026]

Product Description Product Features First domestic green laser machine for mass pruduction High reliability and stability Independly developped Optical system, LIET technology with IP Green/UV laser two ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.