Jiangsu Profile
Product List
8926. Precision Automatic Bonding Equipment for Hybrid Circuit Applications 
[Feb 28, 2026]
[Feb 28, 2026] Product Description Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the significant increase in microwave integrated component production ...
8927. Advanced Front End Ion Implanter for Precision Semiconductor Manufacturing Solutions [Feb 28, 2026]
[Feb 28, 2026] Product Description 1. Product overview Ion implanter is one of the high pressure small accelerators with the largest number of applications. It is the ion source to obtain the required ions, after the acceleration ...
8928. Reliable Semiconductor Adhesive Application Systems for Production Efficiency [Feb 28, 2026]
[Feb 28, 2026] Product Description Certification CE Warranty 1 year Automatic Grade Automatic Installation Desktop Driven Type Electricity + Pneumatic Function Automatical Production Our glue dispensing robot is ...
8929. Innovation Technologies Vacuum Ion Implantation System [Feb 28, 2026]
[Feb 28, 2026] Innovation Technologies Vacuum Ion Implantation System Product Description 1. Product overview Ion implanter is one of the high pressure small accelerators with the largest number of applications. It is the ion ...
8930. Wafer Automatic Transfer System Solution Equipment Factory [Feb 28, 2026]
[Feb 28, 2026] Product Description The Wafer Automatic Transfer System is a precision robotic manipulator designed for semiconductor manufacturing, wafer handling, and vacuum process automation. It ensures high-speed, high-precision, ...
8931. High Efficiency Bonder Wire Bonding Bonder Machine [Feb 28, 2026]
[Feb 28, 2026] Product Description Packaging and delivery Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the significant increase in microwave ...
8932. Precision Automatic Eutectic Flip Chip Die Bonding Machine for IC Packaging [Feb 28, 2026]
[Feb 28, 2026] Die Bonder Chip Bonding Equipment (Die Bonder) Also known as a die bonder, it is a semiconductor packaging device used to mount and attach chips onto substrate packages. It employs various methods such as using nozzles ...
8933. High Quality Ion Implanter Semiconductor Material Small Implanter [Feb 28, 2026]
[Feb 28, 2026] Product Description 1. Product overview Ion implanter is one of the high pressure small accelerators with the largest number of applications. It is the ion source to obtain the required ions, after the ...
8934. Precision Analysis Instrument Focused Ion Beam Scanning Electron Microscope [Feb 28, 2026]
[Feb 28, 2026] Product Description BDB-500 is a Field Emission Scanning Electron Microscope with Focused Ion Beam column for nano-analysis and specimen preparation, which is applied with 'Super Tunnel' technology, low aberration ...
8935. High Precision Wafer Thinning Grinding Machine for Industrial Use [Feb 28, 2026]
[Feb 28, 2026] High Precision Wafer Thinning Machine Grinding Equipment Manufacturers industrial Automation device Product Description High precision grinding machine equipment principle: 1. This series of transverse ...
8936. Advanced Precision Wire Bonding Equipment for Streamlined Production [Feb 28, 2026]
[Feb 28, 2026] High Efficiency Fully Automatic Lead Wire Bonding Bonder Machine Product Description Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the ...
8937. Customized Factory Price Compact Design Industrial Screw Chiller for Chemical Industry [Feb 26, 2026]
[Feb 26, 2026] Product Description Product Introduction Delon Low-Temperature Air-Cooled Screw Chiller is a high-efficiency, energy-saving industrial cooling equipment designed for global industrial clients, integrating advanced screw ...
8938. Professional Automatic Plastic Bottle Mineral Pure Drinking Water Filling Machine [Mar 03, 2026]
[Mar 03, 2026] Product Description CGF series of water filling machine, it is a monoblock unit, integrated with washing filling and capping machine. It is suitable for all kinds of non-gas beverage, such as mineral water, pure water, ...
8939. Dk7763f High Quality Electric Spark High Speed Metal EDM Wire Cutting Machine [Feb 09, 2026]
[Feb 09, 2026] CE certified CNC EDM wire cutting machine DK7750 The company has cooperated with well-known domestic institutions of higher learning, central enterprises, state-owned enterprises, and the world's top 500 enterprises, ...
Company: Taizhou Terui CNC Machine Co., Ltd.
8940. Manual Semi Automatic Aluminum or Gold Desktop Wire Bonders with Factory Price [Feb 28, 2026]
[Feb 28, 2026] Product Description Himalaya DS Series Manual Desktop Wire Bonder The Himalaya DS Series of manual desktop wire bonders provides a versatile and cost-effective solution for precision interconnection tasks. Engineered ...
