Jiangsu Profile
Product List
6991. Optical Fused Silica Quartz Glass Wafer- for Chemical Labs & Industrial Process Windows 
[Nov 26, 2025]
[Nov 26, 2025] Product Description Customized Coating Glass Material SI Window Optical Filter with Infrared Sensor Premium Silicon Wafers OEM Support silicon (SI) and germanium (GE) are the most widely used infrared optical materials. ...
6992. Optical Silicon Wafer Semiconductor Si Wafer for Laser Infrared Optical Components [Nov 26, 2025]
[Nov 26, 2025] Wafer/Silicon Wafer/Silicon Dioxide Wafer/High-Purity Polysilicon/Monocrystalline Silicon Wafer refers to the silicon wafer used in the manufacture of silicon semiconductor integrated circuits. Because of its circular ...
6993. 5W/10W/15W/30W/40W/60W/90W Gxp Series Green UV Picosecond Laser [Dec 16, 2025]
[Dec 16, 2025] Product Description 5W/10W/15W UV Picosecond Laser - High-Precision Solution for Micromachining and Industrial Applications The GXP Series UV Picosecond Laser is a next-generation picosecond laser for ...
6994. Durable P0 Kovar Wire by Dilver for Precision Aging Needs [Dec 15, 2025]
[Dec 15, 2025] Product Description Kovar (Alloy K) is a nickel-iron-cobalt controlled-expansion alloy containing 29% nickel. Its coefficient of expansion, which decreases with rising temperature to the inflection point, matches ...
6995. Advanced High-Speed Automatic Wire Bonding Equipment for Semiconductor Efficient Production [Dec 13, 2025]
[Dec 13, 2025] High-Speed Automatic Lead Wire Bonding Machine Product Description 1.Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the significant ...
6996. High Quality Ion Implanter Semiconductor Material Small Implanter [Dec 13, 2025]
[Dec 13, 2025] Product Description 1. Product overview Ion implanter is one of the high pressure small accelerators with the largest number of applications. It is the ion source to obtain the required ions, after the ...
6997. Innovation Technologies Vacuum Ion Implantation System [Dec 13, 2025]
[Dec 13, 2025] Innovation Technologies Vacuum Ion Implantation System Product Description 1. Product overview Ion implanter is one of the high pressure small accelerators with the largest number of applications. It is the ion ...
6998. Wafer Automatic Transfer System Solution Equipment Factory [Dec 13, 2025]
[Dec 13, 2025] Product Description The Wafer Automatic Transfer System is a precision robotic manipulator designed for semiconductor manufacturing, wafer handling, and vacuum process automation. It ensures high-speed, high-precision, ...
6999. Advanced Automatic Lead Wire Bonding Machine for Precision Tasks [Dec 13, 2025]
[Dec 13, 2025] High Efficiency Fully Automatic Lead Wire Bonding Bonder Machine Product Description Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the ...
7000. Advanced Efficiency Bonder for Precision Semiconductor Wire Bonder Packaging Solutions [Dec 13, 2025]
[Dec 13, 2025] Product Description Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the significant increase in microwave integrated component production ...
7001. Advanced Double-Tube Vertical Furnace for Pi Cuer Annealing Process [Dec 13, 2025]
[Dec 13, 2025] Double-Tube Fully Automatic Vertical Furnace for PI Cuer, annealing, alloy Product Description Product Usage: Integrated circuit wafer glue, BPO glue/PI glue/BCB glue curing, IC (wafer, CMOS, Bumping, TSV, MEMS, ...
7002. Professional Silicone Glue Application System for Electronic Devices [Dec 13, 2025]
[Dec 13, 2025] High quality Automatic Silicone Glue Dispensing Equipment for Semiconductor Industry Product Description Certification CE Warranty 1 year Automatic Grade Automatic Installation Desktop Driven Type Electricity + ...
7003. High Quality 0.8 to 25mm Chip Epoxy Die Bonder TCP/IP Factory Price [Dec 13, 2025]
[Dec 13, 2025] Die Bonder Chip Bonding Equipment (Die Bonder) Also known as a die bonder, it is a semiconductor packaging device used to mount and attach chips onto substrate packages. It employs various methods such as using nozzles ...
7004. Precision Automatic Eutectic Flip Chip Die Bonding Machine for IC Packaging [Dec 13, 2025]
[Dec 13, 2025] Die Bonder Chip Bonding Equipment (Die Bonder) Also known as a die bonder, it is a semiconductor packaging device used to mount and attach chips onto substrate packages. It employs various methods such as using nozzles ...
7005. Budget-Friendly Automatic Die Attach Equipment for IC Packaging [Dec 13, 2025]
[Dec 13, 2025] Die Bonder This series of soft solder die bonding machines is the most accurate and fastest 8-inch (downward compatible with 6-inch) soft solder die bonding machine in the world. Its production capacity and accuracy ...
