Jiangsu Profile
Product List
43576. High Precision Die Bonding Machine for PCB and IC Assembly 
[Feb 28, 2026]
[Feb 28, 2026] Product Description The DA801 IC Linear High-Speed Die Attach Machine is a fully automatic wafer die bonder designed for high accuracy and efficiency in semiconductor packaging. It features a dual dispensing system, ...
43577. Achieve Perfect Alignment with Precision Wafer Mounting Equipment System [Feb 28, 2026]
[Feb 28, 2026] Product Description A vacuum laminator is a precision machine that bonds layers of material (films, foils, PCBs, solar cells, etc.) under controlled heat, pressure, and vacuum to eliminate air bubbles and ensure ...
43578. Semiconductor Sic Sio2 Wafer Stealth Dicing Cutting Equipment [Feb 28, 2026]
[Feb 28, 2026] Product Description Complete SiC (Silicon Carbide) Wafer Laser Cutting Solution This integrated solution is engineered for high-precision, high-efficiency, and high-yield processing of brittle silicon carbide ...
43579. High Precision Stealth Dicing Laser Dicer Machine for IC Glass Ceramics Semiconductor [Feb 28, 2026]
[Feb 28, 2026] Product Description Wafer dicing machine for semiconductor equipment Wafer Dicing Machine The wafer dicing machine is primarily used for precision cutting of semiconductor wafers, integrated circuits, QFN packages, ...
43580. CCD Vision Automatic Alignment Potting Glue Dispensing Machine for LED/Semiconductor [Feb 28, 2026]
[Feb 28, 2026] High Quality Semiconductor SMT Dispensing and Filling Machine Product Description The TSV-200D Desktop Vision Glue Dispensing Machine by Jiangsu Himalaya Semiconductor Co., Ltd. is a high-precision, automated dispensing ...
43581. Epoxy Polyurethane Silicone Dispenser CCD Automated Aligning Glue Dispensing Robot [Feb 28, 2026]
[Feb 28, 2026] High Quality Industrial Dispensing Automation Robot Used for Semiconductor Packaging/SMT Assembly Product Description Standard Features Computer Control, Windows OS CCD visual positioning system Servo Motor UPS ...
43582. Versatile UV Laser Engraving Machine for Professional Use [Feb 28, 2026]
[Feb 28, 2026] 4W / 7W / 10W /15W / 25W UV Laser Marking Machine Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking of food, PVC pipe, medicine packaging ...
43583. Precision Automatic CCD Visual Glue Dispenser for Efficient Bonding [Feb 28, 2026]
[Feb 28, 2026] Automatic CCD Visual Glue Dispenser Machine semiautomatic Three-Axis Desktop Dispensing Robot equipment factory Product Description Standard Features Computer Control, Windows OS CCD visual positioning ...
43584. Precision Laser Cutting Equipment for Superior Grooving Performance [Feb 28, 2026]
[Feb 28, 2026] Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion platform Equipped with special customized laser head, which ensures high cutting quality and low heat ...
43585. Advanced Fully Automatic Desktop Dispensing Machine for Precision Production [Feb 28, 2026]
[Feb 28, 2026] High-Precision Desktop Dispensing Machine Fully Automatic Product Description Standard Features Computer Control, Windows OS CCD visual positioning system Servo Motor UPS and voltage stabilizer ESD grounding ...
43586. Precision Die Bonding Machine for High-Quality Soldering Solutions [Feb 28, 2026]
[Feb 28, 2026] High Quality Fully Automatic Soft Solder Die Bonding Machine Factory Product Description This equipment is a soft solder die bonder designed for thermal die bonding of TO power devices. This equipment is a new ...
43587. Automatic Semiconductor Soft Solder Bonding Die Attach Solution SD800 Die Bonder [Feb 28, 2026]
[Feb 28, 2026] Fully Automatic Die Bonding Machine System manufacturer Product Description Revolutionize Your Production with the SD800 Fully Automatic Die Bonding Machine In the fast-paced world of semiconductor manufacturing, ...
43588. Precision Automatic Eutectic Flip Chip Die Bonding Machine for IC Packaging [Feb 28, 2026]
[Feb 28, 2026] Die Bonder Chip Bonding Equipment (Die Bonder) Also known as a die bonder, it is a semiconductor packaging device used to mount and attach chips onto substrate packages. It employs various methods such as using nozzles ...
43589. Automatic LED/IC Flip Chip Die Bonding Machine [Feb 28, 2026]
[Feb 28, 2026] HMLA-S platform is an off-line automatic micro assembly system developed by the company, which can be equipped with nozzle heating module, material tray/wafer placing plate, ultrasonic module, laser heating module, UV ...
43590. Advanced Wafer Mounting Machine for Semiconductor Thinning Processes [Feb 28, 2026]
[Feb 28, 2026] Product Description Parameter Dimension L933*W450*H317mm Compatible size 6"~8" Total power 500W Input power supply 100-240V AC 50-60HZ Air pressure 0.5-0.8Mpa Film type Blue film/UV film Plate ...
