Jiangsu Profile
Product List
22981. High-Precision CO2 Laser Engraver for Custom Fabric Creations 
[Jul 08, 2026]
[Jul 08, 2026] Product Description It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, ...
22982. Advanced Solidifying Patch Solutions for Streamlined Production Efficiency [Jul 08, 2026]
[Jul 08, 2026] High-Precision Die Bonder Integrated Multi-Functional Patch Solidifying Machine Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and ...
22983. Advanced Industrial Diffusion Systems for Horizontal and Vertical Applications [Jul 08, 2026]
[Jul 08, 2026] Product Description Small Batch/R&D Oxidation Diffusion System This compact oxidation diffusion system is specifically engineered for research and development and small batch production in advanced semiconductor and ...
22984. Smart Automated Cutting Machine for Streamlined Manufacturing Efficiency [Jul 08, 2026]
[Jul 08, 2026] Product Description Compact Single-Station Adhesive Film Laying Machine This machine is an advanced, space-efficient solution for automatically cutting and laying adhesive film onto glass or other surfaces. ...
22985. Advanced Dispensing Machines for Efficient Production and Distribution [Jul 08, 2026]
[Jul 08, 2026] Product Description This device is used for micro assembly, dispensing, and surface mounting processes. It has the characteristics of multi threading, multi timing, flexible process combination, complex logic and ...
22986. Advanced High-Performance Lcr Testing System for Power Electronics [Jul 08, 2026]
[Jul 08, 2026] Product Description QT-3107 LCR RG/CG Testing In house LCR MOSFET RG/CG testing,also applicable for capacitance testing of diodes with a resolution of 1fF. Major Technical Specs: Parameters Min Max Unit Resolution Ratio ...
22987. Heavy-Duty Precision Seam Welding Machines for Industrial Applications [Jul 08, 2026]
[Jul 08, 2026] Product Description PSS-H160 parallel seam welding machine is a semi-automatic equipment. This device can be used for metal bases and covers Airtight packaging between. This equipment is equipped with a highly ...
22988. Advanced High-Precision Laser Drilling Machine with Quick Zoom Technology [Jul 08, 2026]
[Jul 08, 2026] Product Description Product advantages using the high-speed laser drilling control system of acousto-optic devices real-time detection rapid zoom within 100ns level can change laser spot energy density and ...
22989. Precision Laser Marking Technology for Circuit Board Packaging Solutions [Jul 08, 2026]
[Jul 08, 2026] UV Laser/CO2 Laser Marking Machine for The Packaged IC Marking Product Description Brief Description Applicable for the packaged IC marking of DIP, QFN and BGA. Features: 1. Fully-automatic loading and ...
22990. High-Precision 3D UV Laser Engraver for Wood and Metal Crafting [Jul 08, 2026]
[Jul 08, 2026] Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole ...
22991. High Precision 3W UV Laser Engraver for Wood and Plastic Crafts [Jul 08, 2026]
[Jul 08, 2026] Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, ...
22992. High-Precision UV and Infrared Laser Marker for Wafers [Jul 08, 2026]
[Jul 08, 2026] Product Description Brief Description Applicable for the 6-inch, 8-inch and 12-inch wafer marking Features: 1. With the green laser or UV laser, the focusing spot is fine, and it is non-contact marking. 2. ...
22993. High-Precision Laser Engraver for Large PCBA Manufacturing Needs [Jul 08, 2026]
[Jul 08, 2026] Product Description Application areas: 1. Used in household appliances, office equipment, automotive circuits and other fields. 2. Meet the laser marking requirements of PCBA (FPC) circuit board manufacturers. ...
22994. Advanced Wafer Stacking Technology for High-Precision Die Bonding [Jul 08, 2026]
[Jul 08, 2026] Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method Epoxy Bonding precision X/Y≤±25um,θ<±3° ...
22995. Smart Chip Placement Systems for Superior Manufacturing Efficiency [Jul 08, 2026]
[Jul 08, 2026] Product Description Equipment Specifications AUTOMOLD SHM8120(120T) Packaging quantity 2L/F/time/press Press quantity 1-4 presses Applicable L/F size Width:20-80mm Length:124-270mm ...
