Jiangsu Profile
Product List
21991. Advanced Surface Treatment Equipment for Optimal Adhesion Results 
[Dec 13, 2025]
[Dec 13, 2025] Product Description Product features: 1. WINDOWS operating system - Use computer + motion controller, fault sound and light alarm and menu display; 2. Drived by stepping motor and synchronous belt; 3. Equipped ...
21992. Superior C500 Display Glass for High-Tech Semiconductor Machinery [Dec 13, 2025]
[Dec 13, 2025] Product Description Tool Spec Machine Type Cluster ALD Substrate Display Glass Temperature 150-250ºC Depo Rate 0.33nm/min Plasma Source CCP Injection Type Shower head Leak ...
21993. Next-Gen Wafer Bonding System with Advanced Data Logging [Dec 13, 2025]
[Dec 13, 2025] Product Description Exhibition & Customers Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The ...
21994. Advanced Laser Ablation System for Precision Material Removal [Dec 13, 2025]
[Dec 13, 2025] Product Description This laser system is used for laser ablation of the passivating films on the back of passivated emitter rear contact (PERC) solar cells. It supports online and offline production. With compact ...
21995. Advanced Wafer Back Grinding Machine with Integrated Handling Robot [Dec 13, 2025]
[Dec 13, 2025] High Quality Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot Product Description Equipment Advantage Equipped with material information scanning and input system Equipped wtith wafer level ...
21996. Advanced 12-Inch CMP Wafer Cleaning System - Horizon300 [Dec 13, 2025]
[Dec 13, 2025] Product Description 4-Head & 3-Platen polisher; Vertical wafer clean configuration. Integration of multiple advanced endpoint system and a fully precise process control system. Meet CMP process requirements for 28nm ...
21997. Advanced CCD Vision System for Automatic Glue Dispensing [Dec 13, 2025]
[Dec 13, 2025] Vision System Automatic CCD Visual Glue Dispensing Machine Glue Dispensing Equipment Product Description Specifications TSV-200D HSV-200D Dimension (mm) L1120×W740×H760 ...
21998. Automatic CCD Visual Glue Dispenser Machine Semiautomatic Three-Axis Desktop Dispensing Equipment ... [Dec 13, 2025]
[Dec 13, 2025] Industrial Dispensing machine Desktop Robot Glue coating Dispenser device producer Product Description Specifications TSV-200D HSV-200D Dimension (mm) L1120×W740×H760 L1200×W740×H146 Weight (kg) 100 130 Control ...
21999. Automatic Hot Melt Adhesive Silicone Glue Dispenser Machine [Dec 13, 2025]
[Dec 13, 2025] Hot Melt Adhesive Silicone manufactured equipment coating Glue Automatic Desktop Dispenser Machine Product Description Specifications TSV-200D HSV-200D Dimension (mm) L1120×W740×H760 L1200×W740×H146 Weight (kg) 100 130 ...
22000. Advanced Fiber Laser Marking System for Durable Device Engraving [Dec 13, 2025]
[Dec 13, 2025] Product Description Product Features Structure: One-piece, split, vertical, horizontal, etc., for all testers High Reliability, long life fiber laser Max. UPH up to 60K Offline control mode,good ...
22001. High-Precision Dual Drive Gantry Laser Cutter for Metal Sheets [Dec 13, 2025]
[Dec 13, 2025] Product Description MPS-8025H series is a dual drive gantry interactive optical fiber laser cutting equipment tailored for the sheet metal processing industry. It can cut all kinds of metal materials, with the ...
22002. Small Semiconductor Die Bonding System Wafer Die Attach Eutectic Bonder [Dec 13, 2025]
[Dec 13, 2025] Product Description Exhibition & Customers Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The ...
22003. Precision Ceramic Laser Dicing Machine with CCD Positioning Technology [Dec 13, 2025]
[Dec 13, 2025] Product Description Product Features High peak power fiber laser.Stable and reliable. Long service life Laser waveform segmentation editing patented technology One machine for multiple applications of drilling, ...
22004. Industrial 200-1000mm Belt Width Furnace for Electronic Parts [Dec 13, 2025]
[Dec 13, 2025] Product Description 1,Index parameter Net band width: 200-1000MM Contrl temperature area: 3-8 Temperature zone length: 300/450/1000mm Maximum temperature: 350 degrees centigrade Furnace height: 30-100 Atmosphere: air ...
22005. High Precision 30W CO2 Laser Marking Machine for PCB Fabrication [Dec 13, 2025]
[Dec 13, 2025] Product Description It can be widely used in graphic marks on craft gifts, food packaging, electronic components, PCB bar codes, FPC, ceramics, semiconductors, crystal glass, plastic parts, silicone rubber products and ...
