Jiangsu Profile

Product List
20731. Wholesale Price: Superior Performance. Ribbon-Coated Glass Fiber Cloth, Featuring Heat Insulation, ...
[Jul 24, 2025]

Product Description Aluminized Fiberglass Fabric are made of fiberglass fabrics laminated an aluminum foil or film on one side. It can resistant radiant heat, and has a smooth surface, high strength, good luminous ...
Company: Nan Jing New Fire Composite Co., Ltd
20732. Laser Direct Imaging System Special Machine Fine Line Processing Industrial Equipment Manufacturer
[Jul 22, 2025]

Product DescriptionProduct features and advantages: Special machine for fine line processing, minimum analytical capacity up to 15/15um, to meet the requirements of msAP process With independent super algorithm DMD ...
20733. High Quality Customized Flip Chip Die Bonder Machine for Semiconductor Packaging
[Jul 22, 2025]

High Quality Customized Flip Chip Die Bonder Machine for Semiconductor Packaging Product Description Exhibition & Customers Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged ...
20734. Bsi-CCD Wafer Dopant Laser Annealing Equipment Precise Energy Density Control
[Jul 22, 2025]

Bsi-CCD Wafer Dopant Laser Annealing Equipment Precise Energy Density Control Product Description Product Features The first in China, 8 inch mass production equipment Precise energy density control UV laser with ...
20735. Small Versatile Lithography Product Equipped with MLC600 Maskless Lithography System
[Jul 22, 2025]

Small Versatile Lithography Product Equipped With MLC600 Maskless Lithography System Product Description Exhibition & Customers Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in ...
20736. Projection Lithography Machine Suitable for Packaging Micro LED Mems
[Jul 22, 2025]

Product Description MPS-02 Projection lithography Product advantages 1.High yield 2.Modular design 3.High reliability 4.Suitable for packaging MicroLED MEMS and other processes Wafer Size 200mm Wafer(300mm ...
20737. High End Semiconductor Wafer Saw Machine Wafer Saw Euqipment
[Jul 22, 2025]

High End Semiconductor Wafer saw Machine wafer saw euqipment Product Description It can be widely used in Silicon wafers, GaAs, GaN, Glass, Sic, PCB board , QFN, DFN, Pottery and porcelain etc. Jiangsu ...
20738. 4W / 7W / 10W /15W / 25W 355nm UV Laser Engraving Machine Wood and Metal Laser Engraver Machine
[Jul 22, 2025]

4W / 7W / 10W /15W / 25W 355nm UV Laser Engraving Machine Wood and Metal Laser Engraver Machine Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. ...
20739. High-Power Sic Ingot Laser Slicing Equipment with Smooth Processing Surface
[Jul 22, 2025]

High-Power Sic Ingot Laser Slicing Equipment with Smooth Processing Surface Product Description Equipment features: 1. High dynamic and high-power femtosecond laser 2. High precision optical scanning processing ...
20740. Automatic Focusing PCBA Laser Marking Machine for Household Appliances/Office Equipment
[Jul 22, 2025]

Automatic Focusing PCBA Laser Marking Machine for Household Appliances/Office Equipment Product Description Application areas: 1. Used in household appliances, office equipment, automotive circuits and other ...
20741. Mu3016 Arm Automatic Six - Density Universal Test Machine Suitable for Communication/ Computer
[Jul 22, 2025]

Product Description Application Exhibition & Customers Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry ...
20742. China Factory 6/8-Inch CMP Device - Horizon-T Compatible with 6/8-Inch Wafers
[Jul 22, 2025]

Product Description Compatible with 6/8-inch wafers, fully automatic dry in and dry out, flexible process switching, and wide applicability Support the flattening process requirements of SiC, GaN third-generation ...
20743. Automatic Laser Deflashing Machine with Automatic Loading and Unloading Function
[Jul 22, 2025]

Product Description Product Features Laser scanning and vaporization for deflashing. No chemical softening or high-pressure water jetting required Optical shaping technology, ensuring no damage to tube pins.Improving ...
20744. Manufacture High Efficiency Laser Glue Removal and Repair Machine with Visual Positioning
[Jul 22, 2025]

Product Description Product Features Custom C02 or UV/Green picosecond laser Self-developed software and processing technology that meets different process requirements Glue removal and window opening Support ...
20745. Customized High Efficiency Laser Trimming Machine for Circuit Board Industry Line Repair
[Jul 22, 2025]

Product Description Product Features Custom C02 or UV/Green picosecond laser Self-developed software and processing technology that meets different process requirements Glue removal and window opening Support ...
