Jiangsu Profile
Product List
19456. High-Precision Rectifying and Rewinding Flying Marking Machine for Pharmaceutical/Food/ Daily ... 
[Sep 18, 2025]
[Sep 18, 2025] Product Description Brief Description The whole machine can cover 6-9 channes, productivity for single channel is ≥ 240pcs/min. Using the DRACO series of short-wave lasers with the independent intellectual ...
19457. Anti-Counterfeiting Flying Marking Machine for Strip Cigarettes/ Cigars Logo Printing [Sep 18, 2025]
[Sep 18, 2025] Product Description Brief Description The laser marking machine can code cigarettes, package cigarettes, strip cigarettes, and cigars, which can play the role of anti-counterfeiting, traceability management and so ...
19458. High Temperature Energy Incinerator for Producing High Concentration of Organic Waste Gas [Sep 18, 2025]
[Sep 18, 2025] Product Description 1,Scope of application The organic waste gas flow rate is 1000 ~ 10000 Nm3/h, and the concentration is higher than 3000mg/m3. 2,application area Electronic sintering waste gas, odor, reaction kettle ...
19459. Automatic High Precision Die Bonder Die Bonding Machine for Qfp/Lqfp/Qfn [Sep 18, 2025]
[Sep 18, 2025] Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
19460. Mesh Belt Type Rubber Discharge Sintering Furnace for Ceramic Substrate Printing [Sep 18, 2025]
[Sep 18, 2025] Product DescriptionThe mesh belt type adhesive discharge sintering furnace is applied to the adhesive discharge sintering of thick film circuits for ceramic substrate printing; Drying and calcination of metal honeycomb ...
19461. Sic Laser Annealing Semiconductor Equipment Equipped with Efem Transmission System [Sep 18, 2025]
[Sep 18, 2025] Product Description Laser Annealing Machine for Sic Equipment features: 1. Modular design and integration of the entire machine, compatible with 4, 6, and 8-inch thin chip wafers 2. Integrated self-developed ...
19462. Desktop Automatic Glue Dispensing Machine Semiconductor Dispenser Device with Visual Function [Sep 18, 2025]
[Sep 18, 2025] Desktop Automatic Glue Dispensing Machine semiconductor Dispenser device with Visual Function Product Description Standard Features Computer Control, Windows OS CCD visual positioning system Servo Motor UPS ...
19463. High-Efficient High Stability UV Laser Marking Cutting Machine for Wafers Cutting Processing [Sep 18, 2025]
[Sep 18, 2025] High Precision High-Efficient UV Laser Marking Cutting Machine for Wafers Cutting Processing Product Description Brief Description Applicable for the 2 inch, 4 inch, 8 inch and 12 inch wafers cutting processing ...
19464. Oxidation Diffusion Furnace with Nitrogen and Hydrogen Annealing/Sintering/Alloying/Curing [Sep 18, 2025]
[Sep 18, 2025] Product Description Product performance: Fully automatic: Cassette to Cassette Modular design, SEMI standard Meet the 4-8/12 inch wafer process 1-4/5 tubes per unit, quartz/SiC reaction tubes Constant temperature zone: ...
19465. Flush Runner Residual Glue Machine with Light Curtain Protection and Safety Door Protection Device [Sep 18, 2025]
[Sep 18, 2025] Product Description features Automatic glue removeralso known as Flush runner residual glue machine and semiconductor strippers; 1. Equipment function: one-time punching (removal) of the gate runner of the product ...
19466. Dual Dispensing System Fully Automatic Submicron Placement Accuracy Eutectic Die Bonding Machine [Sep 18, 2025]
[Sep 18, 2025] Product Description DA801 IC Linear High-speed Die Attach Wafer size: 6"- 8"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
19467. Semiconductor Packaging Equipment/LED/High Precision Die Bonder/Die Bonding Machine / Die Attach [Sep 18, 2025]
[Sep 18, 2025] Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
19468. Thick Film Sintering Furnace Suitable for The Sintering of High-Precision Chip Resistors [Sep 18, 2025]
[Sep 18, 2025] Product Description 1,Index parameter Rated temperature: rt-1050 C Maximum temperature: 1050 degrees centigrade Sintering atmosphere: air Heating element: heating FEC ceramic fiber heater Control temperature ...
19469. Melting Sealing Furnace Specialized in The Heat Treatment Process of The Product [Sep 18, 2025]
[Sep 18, 2025] Product Description 1,Index parameter: Temperature: Rt - 1120 degrees centigrade Atmosphere: air / nitrogen / hydrogen / other inert gases Control temperature area: 5-16 temperature zones Furnace height: 50 - ...
19470. Flip-Chip/High-Precision Die Attach Packaging Machine Chip Mounter Equipped with Die Attach System [Sep 18, 2025]
[Sep 18, 2025] Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially ...
