Jiangsu Profile
Product List
17011. Wafer Laser Scribing / Cutting Machine with Multiple Laser Operation Modes 
[Jul 22, 2025]
[Jul 22, 2025] Product Description Product Features Multiple laser operation modes and beam shaping, ensuring optimal incision quality and efficiency Correction technology ensures high precision machining and consistency ...
17012. High-Efficient High Stability UV Laser Marking Cutting Machine for Wafers Cutting Processing [Jul 22, 2025]
[Jul 22, 2025] High Precision High-Efficient UV Laser Marking Cutting Machine for Wafers Cutting Processing Product Description Brief Description Applicable for the 2 inch, 4 inch, 8 inch and 12 inch wafers cutting ...
17013. High Efficiency Fully Automatic Lead Wire Bonding Bonder Machine [Jul 22, 2025]
[Jul 22, 2025] High Efficiency Fully Automatic Lead Wire Bonding Bonder Machine Product Description Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the ...
17014. High Quality Chip Testing and Detection Wafer Bonder Semiconductor Sorting Equipment [Jul 22, 2025]
[Jul 22, 2025] High Quality Chip Testing and Detection Wafer Bonder Semiconductor Sorting Equipment Product Description Equipment Specifications PIaK PLACE HANDLER SHF9000 Test station 1/2/4/8 site Nozzle ...
17015. High Quality Full-Automatic Semiconductor Wafers Back Grinding Equipment for Si Wafer/Glass/Metal ... [Jul 22, 2025]
[Jul 22, 2025] High Quality Full-Automatic Semiconductor Wafers Back Grinding Equipment for Si Wafer/Glass/Metal Plating Product Description Equipment Advantage Equipped with material information scanning and input ...
17016. Mesh Belt Type Rubber Discharge Sintering Furnace for Ceramic Substrate Printing [Jul 22, 2025]
[Jul 22, 2025] Product DescriptionThe mesh belt type adhesive discharge sintering furnace is applied to the adhesive discharge sintering of thick film circuits for ceramic substrate printing; Drying and calcination of metal honeycomb ...
17017. Semiconductor Oven Machine Customizable Temperaturehumidity/Vacuum/Cleanliness/Gas Concentratio [Jul 22, 2025]
[Jul 22, 2025] Product Description High temperature vacuum oven Large vacuum drying oven designed for various purposes of vacuum drying. Leave space for installing the vacuum pump. It adopts quick connection flange piping method and ...
17018. High Speed Automatic Double Dispensing Die Bonder Semiconductor Bonding Equipment [Jul 22, 2025]
[Jul 22, 2025] High Speed Automatic Double Dispensing Die Bonder Semiconductor Bonding Equipment Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method ...
17019. Laser Debonding Machine with Real-Time Monitoring/ Automatic Compensation/ Ensuring Process ... [Jul 22, 2025]
[Jul 22, 2025] Product Description Product Features Laser debonding, stripping and cleaning functions Square top hat beam, benefits high debonding efficiency and low thermal damage Real-time monitoring and automatic compensation, ...
17020. Performance High Efficiency PCB/FPC/RF/Touchid/Type-C/TF-Card/LGA/BGA Module Laser Cutting Machine [Jul 22, 2025]
[Jul 22, 2025] Product Description Product Features Staggered cutting with double stations for high efficiency Adopt telecentric lens, good cutting verticality Off-axis CCD automatic positioning system, high cutting accuracy Complete ...
17021. Sic Laser Annealing Semiconductor Equipment Equipped with Efem Transmission System [Jul 22, 2025]
[Jul 22, 2025] Product Description Laser Annealing Machine for Sic Equipment features: 1. Modular design and integration of the entire machine, compatible with 4, 6, and 8-inch thin chip wafers 2. Integrated self-developed ...
17022. Anti-Counterfeiting Flying Marking Machine for Strip Cigarettes/ Cigars Logo Printing [Jul 22, 2025]
[Jul 22, 2025] Product Description Brief Description The laser marking machine can code cigarettes, package cigarettes, strip cigarettes, and cigars, which can play the role of anti-counterfeiting, traceability management and so ...
17023. Green Laser/UV Laser Wafer Marking Machine for 6-Inch/8-Inch /12-Inch [Jul 22, 2025]
[Jul 22, 2025] Green Laser/UV Laser Wafer Marking Machine for 6-Inch/8-Inch /12-Inch Product Description Brief Description Applicable for the 6-inch, 8-inch and 12-inch wafer marking. Features: 1. With the green laser or UV ...
17024. Mh601L High Precision Testing Machine Suitable for Communication/Computer / Peripheral [Jul 22, 2025]
[Jul 22, 2025] Product Description Exhibition & Customers Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The ...
17025. UV Laser Cutting Machine with CCD Automatic Positioning Used for FPC/RF/Fpcba/PCBA/Cvl/SIP [Jul 22, 2025]
[Jul 22, 2025] Product Description Brief Description 1. With high-performance UV lase and self-developed control software. 2. With the high-precision motion platform system and high-precision galvanometer scanner. 3. With ...
