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Factory Price Hmds Pretreatment Oven with Good Pretreatment Performance
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16876.

Factory Price Hmds Pretreatment Oven with Good Pretreatment Performance Open Details in New Window [Oct 16, 2025]

Product Description Advantages of HMDS pretreatment system: 1. The pretreatment performance is better. Since the HMDS treatment is carried out after several nitrogen replacements, there will be no interference ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Wafer Laser Scribing / Cutting Machine with Multiple Laser Operation Modes
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16877.

Wafer Laser Scribing / Cutting Machine with Multiple Laser Operation Modes Open Details in New Window [Oct 16, 2025]

Product Description Product Features Multiple laser operation modes and beam shaping, ensuring optimal incision quality and efficiency Correction technology ensures high precision machining and ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Density Consistency Ld Concentration Middle Deslagger Pulping Ceramic Cone Density HD Low ...
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16878.

High Density Consistency Ld Concentration Middle Deslagger Pulping Ceramic Cone Density HD Low ... Open Details in New Window [Sep 23, 2025]

Product Description The cleaner used in the paper industry is mainly divided into high-concentration cleaner, low-concentration cleaner, heavy slag cleaner, and light slag cleaner. High-concentration cleaner: the pulp ...

Company: Jiangsu Leizhan International Trade Co., Ltd.

Brazed Cast Iron Grinding Head Diamond Grinding Head Cast Iron Grinding Head
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16879.

Brazed Cast Iron Grinding Head Diamond Grinding Head Cast Iron Grinding Head Open Details in New Window [Sep 23, 2025]

Diamond bits Brazed Diamond Grinding Head for die grinder Product name: Brazed diamond grinding head Product material: high manganese steel matrix, diamond particles Process: New brazing process Applicable ...

Company: YIWU MINGDIAO TRADING CO., LTD

9" High Quality Diamond Saw Blade for Cutting Grinding Marble Granite Hard Stones
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16880.

9" High Quality Diamond Saw Blade for Cutting Grinding Marble Granite Hard Stones Open Details in New Window [Sep 23, 2025]

Product Description Diamond Saw Blade A diamond saw blade is a saw blade which has diamonds fixed on its edge for cutting hard or abrasive materials. There are many types of diamond blade, and they have many uses, ...

Company: Zhenjiang Suran Tools Co., Ltd.

Small Scale Production Egg Powder Laboratory Centrifugal Spray Dryer Machine with Competitive Price
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16881.

Small Scale Production Egg Powder Laboratory Centrifugal Spray Dryer Machine with Competitive Price Open Details in New Window [Sep 22, 2025]

Product Description Spray Drying Machine LPG high-speed centrifugal Spray Dryer is applicable for the emulsion, suspension, paste and liquid solution. In polymers and resins, fuels, paints, ceramics, glass type, ...

Company: Changzhou Chuangke Drying Granulating Equipment Co., Ltd.

Independent Floral European Style Shower Unit, Modular Complete Bathroom
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16882.

Independent Floral European Style Shower Unit, Modular Complete Bathroom Open Details in New Window [Sep 20, 2025]

Click To Learn More Styles And Choose Main Parameters body 35mm grade tempered glass++PEC Resin fiber board Back board 35mm grade tempered glass++PEC Resin fiber board Frame aviation aluminum ...

Company: Nanjing Zhengbiao Environmental Protection Technology Co., Ltd

Rqj-200A Hot Cutting Machine Used in Htcc, Mlcc Industries
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16883.

Rqj-200A Hot Cutting Machine Used in Htcc, Mlcc Industries Open Details in New Window [Sep 18, 2025]

Product Description The hot cutting equipment is the main component of the LTCC production line, which can be programmed by computer and automatically and precisely controlled to quickly and accurately cut the laminated ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Semiconductor Industry Wafer ID Marking Equipment with Fully Automatic Visual Positioning
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16884.

Semiconductor Industry Wafer ID Marking Equipment with Fully Automatic Visual Positioning Open Details in New Window [Sep 18, 2025]

Semiconductor Industry Wafer ID Marking Equipment with Fully Automatic Visual Positioning Product Description Fully automatic wafer ID marking equipment Equipment features: Adopting high-precision two-dimensional ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Infrared/Green/UV Laser Marking Machine for The 6-Inch/ 8-Inch/12-Inch Wafer Marking
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16885.

Infrared/Green/UV Laser Marking Machine for The 6-Inch/ 8-Inch/12-Inch Wafer Marking Open Details in New Window [Sep 18, 2025]

Product Description Brief Description Applicable for the 6-inch, 8-inch and 12-inch wafer marking Features: 1. With the green laser or UV laser, the focusing spot is fine, and it is non-contact marking. 2. ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Qxh-3116 Lead Wire Bonding Bonder Machine Fully Automatic
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16886.

Qxh-3116 Lead Wire Bonding Bonder Machine Fully Automatic Open Details in New Window [Sep 18, 2025]

QXH-3116 Lead Wire Bonding Bonder Machine Fully Automatic Product Description Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Large Format PCBA Laser Marking Machine with Automatic Focusing System
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16887.

High-Precision Large Format PCBA Laser Marking Machine with Automatic Focusing System Open Details in New Window [Sep 18, 2025]

Product Description Application areas: 1. Used in household appliances, office equipment, automotive circuits and other fields. 2. Meet the laser marking requirements of PCBA (FPC) circuit board manufacturers. ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Green Laser Marking Machine on Mobile Digital Products/Copper Foil/FPC Steel ...
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16888.

Green Laser Marking Machine on Mobile Digital Products/Copper Foil/FPC Steel ... Open Details in New Window [Sep 18, 2025]

Green Laser Marking Machine On Mobile Digital Products/Copper Foil/FPC Steel Sheet/Pi/Cvl/Barcode/Qr Codel Product Description Brief Description The equipment can realize automatic loading and unloading for ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Quality Automatic 8-Inch/12-Inch Green Laser or UV Laser Wafer Marking Machine
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16889.

High Quality Automatic 8-Inch/12-Inch Green Laser or UV Laser Wafer Marking Machine Open Details in New Window [Sep 18, 2025]

High Quality Automatic 8-Inch/12-Inch Green Laser or UV Laser Wafer Marking Machine Product Description Brief Description Applicable for the 6-inch, 8-inch and 12-inch wafer marking. Features: 1. With the green ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Flip Chip Die Bonder Machine for Semiconductor Packaging
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16890.

Flip Chip Die Bonder Machine for Semiconductor Packaging Open Details in New Window [Sep 18, 2025]

Flip Chip Die Bonder Machine for Semiconductor Packaging Product Description Category Specification Model SHD8120 Loading Method Wafer stacking and tray Bonding Method Epoxy Bonding Precision X/Y ≤ ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.