Jiangsu Profile
Famous Export Brand
Featured Products
Product List
15766. 99.9% Fused Silica Sand for Refractory Materials Calcined Type Stable Performance 
[Feb 07, 2026]
[Feb 07, 2026] Company Profile Runlai Quartz Technology Quartz is a precious mineral forged by millions of years of the Earth's natural processes. Located on the shores of the Yellow Sea in Eastern Asia lies the base of China's ...
15767. Low Iron Fused Silica Sand Fe2o3≤0.01% for Solar Panel Production High Purity [Feb 07, 2026]
[Feb 07, 2026] Company Profile Runlai Quartz Technology Quartz is a precious mineral forged by millions of years of the Earth's natural processes. Located on the shores of the Yellow Sea in Eastern Asia lies the base of China's ...
15768. High-Precision Fiber Laser Marking Machine for Flexible Packaging Solutions [Feb 28, 2026]
[Feb 28, 2026] Engraving Marker Logo Fiber Laser Marking Machine for flexible Packing Films Product Description Brief Description Fiber Laser mainly applicable to metal materials, partial plastic materials and coated ...
15769. High Efficiency Automatic Dispenser Machine for OEM Applications [Feb 28, 2026]
[Feb 28, 2026] Manufacturer OEM Customized High Efficiency dispenser device Fully Automatic Dispensing Machine Product Description Standard Features 1. Computer control with Windows OS 2. CCD visual positioning ...
15770. Precision UV Laser Cutter for Flexible Pcbs and Fpcs [Feb 28, 2026]
[Feb 28, 2026] Product Description Brief Description 1. With high-performance UV lase and self-developed control software. 2. With the high-precision motion platform system and high-precision galvanometer scanner. 3. With ...
15771. Advanced Fully Automatic Wafer Marking Machine for 2D and 1d Codes [Feb 28, 2026]
[Feb 28, 2026] Fully Automatic Wafer ID Marking Equipment Suitable for Marking 2D Codes/One-Dimensional Codes Product Description Fully automatic wafer ID marking equipment Equipment features: Adopting high-precision two-dimensional ...
15772. High-Precision Barcode and Qr Code Laser Marking Machine [Feb 28, 2026]
[Feb 28, 2026] Product Description Brief Description Applicable for the 6-inch, 8-inch and 12-inch wafer marking Features: 1. With the green laser or UV laser, the focusing spot is fine, and it is non-contact marking. 2. ...
15773. Precision Laser Slotting Machine for Advanced Wafer Manufacturing [Feb 28, 2026]
[Feb 28, 2026] This machine is a specialized equipment for semiconductor wafer Laser Grooving, designed as a fully automatic model, and adopts a plug type (customized special) material box feeding method. The equipment integrates ...
15774. High-Performance Laser Imaging System for Precise Line Processing [Feb 28, 2026]
[Feb 28, 2026] Product DescriptionProduct features and advantages: Special machine for fine line processing, minimum analytical capacity up to 15/15um, to meet the requirements of msAP process With independent super algorithm DMD ...
15775. High-Precision Laser Cutting Machine for Sheet Metal Processing [Feb 28, 2026]
[Feb 28, 2026] Automatic Laser Power Drum Cutting Machine for Traditional Sheet Metal Processing Product Description MPS-1500SL series laser processing flexible production line is the latest "fully automatic sheet metal laser ...
15776. High-Power 10W/15W/25W UV Laser Engraving Machine for Wood and Metal [Feb 28, 2026]
[Feb 28, 2026] 4W / 7W / 10W /15W / 25W 355nm UV Laser Engraving Machine Wood and Metal Laser Engraver Machine Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. ...
15777. Reliable Electronics Welding Machines for Precision Bonding Tasks [Feb 28, 2026]
[Feb 28, 2026] Product Description Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the significant increase in microwave integrated component production ...
15778. Precision Automatic Silicone Glue Dispenser for Efficient Bonding [Feb 28, 2026]
[Feb 28, 2026] Hot Melt Adhesive Silicone manufactured equipment coating Glue Automatic Desktop Dispenser Machine Product Description Specifications TSV-200D HSV-200D Dimension (mm) L1120×W740×H760 ...
15779. High-Precision UV Laser Cutting Machine for Wafer Production [Feb 28, 2026]
[Feb 28, 2026] High Precision High-Efficient UV Laser Marking Cutting Machine for Wafers Cutting Processing Product Description Brief Description Applicable for the 2 inch, 4 inch, 8 inch and 12 inch wafers cutting ...
15780. Precision Laser Debonding and Stripping Equipment for Professionals [Feb 28, 2026]
[Feb 28, 2026] Automatic Compensation Laser Debonding/Stripping Machine Product Description Product Features Laser debonding, stripping and cleaning functions Square top hat beam, benefits high debonding efficiency and low thermal ...
