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High-Performance Modular Laser Annealing System for Sic Integration
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15271.

High-Performance Modular Laser Annealing System for Sic Integration Open Details in New Window [Dec 13, 2025]

Hot Selling Modular Design and Integration Laser Annealing Machine for Sic Product Description Laser Annealing Machine for Sic Equipment features: 1. Modular design and integration of the entire machine, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Laser IC Marking System with Advanced Mes Mark Technology
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15272.

High-Precision Laser IC Marking System with Advanced Mes Mark Technology Open Details in New Window [Dec 13, 2025]

Laser IC Marking Equipment With MES Mark module system Product Description Laser IC Marking Equipment Equipment features: 1. Support MES Mark module system 2. Mark Auto download 3. Automatic generation of ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Performance Flip Chip Die Bonder for Semiconductor Manufacturing
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15273.

High-Performance Flip Chip Die Bonder for Semiconductor Manufacturing Open Details in New Window [Dec 13, 2025]

Flip Chip Die Bonder Machine for Semiconductor Packaging Product Description Category Specification Model SHD8120 Loading Method Wafer stacking and tray Bonding Method Epoxy Bonding Precision X/Y ≤ ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Green and UV Laser Wafer Marking Machine
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15274.

High-Precision Green and UV Laser Wafer Marking Machine Open Details in New Window [Dec 13, 2025]

Green Laser/UV Laser Wafer Marking Machine for 6-Inch/8-Inch /12-Inch Product Description Brief Description Applicable for the 6-inch, 8-inch and 12-inch wafer marking. Features: 1. With the green laser or UV ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Speed Laser Marking System for Automotive PCBA Components
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15275.

High-Speed Laser Marking System for Automotive PCBA Components Open Details in New Window [Dec 13, 2025]

Fast Speed / High Response Large Format PCBA Laser Marking Machine for Automotive Circuits Product Description Application areas: 1. Used in household appliances, office equipment, automotive circuits and other ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Power 10W/15W/25W UV Laser Engraving Machine for Wood and Metal
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15276.

High-Power 10W/15W/25W UV Laser Engraving Machine for Wood and Metal Open Details in New Window [Dec 13, 2025]

4W / 7W / 10W /15W / 25W 355nm UV Laser Engraving Machine Wood and Metal Laser Engraver Machine Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Fully Automatic Laser Marking System for Versatile Applications
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15277.

High-Precision Fully Automatic Laser Marking System for Versatile Applications Open Details in New Window [Dec 13, 2025]

High Efficiency Fully Automatic Dedicated Laser Precision Marking Equipment Product Description Product Features Provide customized and fully automated solutions Customized control software based on customer ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Automatic Laser Cutting Machine for Sheet Metal
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15278.

Advanced Automatic Laser Cutting Machine for Sheet Metal Open Details in New Window [Dec 13, 2025]

Automatic Laser Power Drum Cutting Machine for Traditional Sheet Metal Processing Product Description MPS-1500SL series laser processing flexible production line is the latest "fully automatic sheet metal laser ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Ldi - M30 Series Direct Imaging System Wet Film Exposure for Inner Circuit
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15279.

Ldi - M30 Series Direct Imaging System Wet Film Exposure for Inner Circuit Open Details in New Window [Dec 13, 2025]

Product DescriptionProduct features and advantages: Deep cultivation of inner wet film field , special wet film processing efficiency breakthrough , up to 10500 panels / day With high quality and high power composite ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High End Ceramic Punching Equipment with High Precision Laser Processing System
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15280.

High End Ceramic Punching Equipment with High Precision Laser Processing System Open Details in New Window [Dec 13, 2025]

Product Description Introduction: High precision laser processing system: galvanometer+cutting head, integrated advantages Ø Dual workstation processing, improving efficiency Fully automatic loading and ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Ceramic Laser Cutter for Efficient Manufacturing Solutions
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15281.

High-Precision Ceramic Laser Cutter for Efficient Manufacturing Solutions Open Details in New Window [Dec 13, 2025]

Ceramic laser processing equipment Product Description The equipment uses a high-energy laser to scrib, drill and cut ceramic materials such as alumina and aluminum nitride. Benefits: 1.High precision: Adopt ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Precision Laser Marking Systems for All Material Types
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15282.

Precision Laser Marking Systems for All Material Types Open Details in New Window [Dec 13, 2025]

High Quality PCB laser marking system Product Description This system realizes fully automatic online dynamic marking for the PCB industry, and achieves fully automatic loading and unloading through the SMEMA standard ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision UV Laser Marker for Custom Mobile Phone PCBA
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15283.

High-Precision UV Laser Marker for Custom Mobile Phone PCBA Open Details in New Window [Dec 13, 2025]

Product Description Brief Description Applicable for the digital products, wearable devices, automobile PCBA, mobile phone PCBA, FPC and so on. Marking on the Rigid and flexible printed circuit board ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Precision Epoxy Adhesive Dispenser for SMT Manufacturing Solutions
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15284.

Precision Epoxy Adhesive Dispenser for SMT Manufacturing Solutions Open Details in New Window [Dec 13, 2025]

Specification Specifications Jet-10 Dispensing Machine Dimension(mm) L761×W1350×H1560 Dispensing Area(mm) X: 320 Y: 400 Z: 30 Repeatability (mm) ±0.005 Maximum moving speed (mm/s) 1300 Maximum acceleration (g) 1.3 ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Precision Laser Debonding and Stripping Equipment for Professionals
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15285.

Precision Laser Debonding and Stripping Equipment for Professionals Open Details in New Window [Dec 13, 2025]

Automatic Compensation Laser Debonding/Stripping Machine Product Description Product Features Laser debonding, stripping and cleaning functions Square top hat beam, benefits high debonding efficiency and low thermal ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.