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High-Precision Automatic Die Bonding Equipment for Semiconductor Production
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3076.

High-Precision Automatic Die Bonding Equipment for Semiconductor Production Open Details in New Window [Dec 23, 2025]

Fully Automatic Die Bonding Machine System manufacturer Product Description This series of soft solder die bonding machines is the most accurate and fastest 8-inch (downward compatible with 6-inch) soft solder die ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

20L & 5 Gallon Industrial Water Bottling Machine High-Capacity Bottling Equipment
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3077.

20L & 5 Gallon Industrial Water Bottling Machine High-Capacity Bottling Equipment Open Details in New Window [Dec 20, 2025]

Fully Automatic 5 Gallon Mineral Water Bottling Filling Capping and Packing Machine Product Description The 5-gallon water filling machine is a fully automatic solution designed for bottling purified and mineral ...

Company: Zhangjiagang Beyond Machinery Co., Ltd.

Advanced High-Speed Die Attach Equipment for Qfn and Dfn Packaging Solutions
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3078.

Advanced High-Speed Die Attach Equipment for Qfn and Dfn Packaging Solutions Open Details in New Window [Dec 19, 2025]

Product Description This high-speed automated assembly and testing system is a cutting-edge solution for manufacturers seeking ultra-efficient, reliable, and scalable production. Its advanced motion control, parallel ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Efficient Semiconductor Assembly Gluing Equipment for Modern Production
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3079.

Efficient Semiconductor Assembly Gluing Equipment for Modern Production Open Details in New Window [Dec 19, 2025]

Product Description Certification CE Warranty 1 year Automatic Grade Automatic Installation Desktop Driven Type Electricity + Pneumatic Function Automatical Production Our glue dispensing robot is ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Restaurant Wastewater Treatment Sludge Dewatering Equipment
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3080.

Restaurant Wastewater Treatment Sludge Dewatering Equipment Open Details in New Window [Nov 28, 2025]

Introduction Our main product is screw press. The screw press is used to separate soild from liquid. Benefiting by the special structure of fixed rings and moving rings, it allows continuous automatic operation ...

Company: Yixing Pioniere Environmental Protection Equipment Co., Ltd.

Sludge Dewatering Equipment for Printing & Dyeing Wastewater/Municipal Wastewater/Farm Wastewater
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3081.

Sludge Dewatering Equipment for Printing & Dyeing Wastewater/Municipal Wastewater/Farm Wastewater Open Details in New Window [Nov 28, 2025]

Introduction Our main product is screw press. The screw press is used to separate soild from liquid. Benefiting by the special structure of fixed rings and moving rings, it allows continuous automatic operation ...

Company: Yixing Pioniere Environmental Protection Equipment Co., Ltd.

Premium Fire Safety Equipment at Affordable Wholesale Rates
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3082.

Premium Fire Safety Equipment at Affordable Wholesale Rates Open Details in New Window [Dec 13, 2025]

Product introduction Specification 2KG 3KG 5KG 6KG 10KG (mm) Diameter 114 114 140 152 140 152 159 Bottom type Concave (L) Volume 3.0 4.5 7.5 9 15 (kg/L) Filling ratio 0.67 (mm) Cylinder length 425 595 615 570 760 665 ...

Company: Jiangsu Huiyuan Fire-Fightiing Science &Technology Co., Ltd.

Advanced High-Speed Automatic Wire Bonding Equipment for Semiconductor Efficient Production
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3083.

Advanced High-Speed Automatic Wire Bonding Equipment for Semiconductor Efficient Production Open Details in New Window [Dec 13, 2025]

High-Speed Automatic Lead Wire Bonding Machine Product Description 1.Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the significant ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Diodes and Transistors Die Bonding Machine Welding Head Sot SOD Patch Equipment
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3084.

Diodes and Transistors Die Bonding Machine Welding Head Sot SOD Patch Equipment Open Details in New Window [Dec 13, 2025]

Diodes and transistors die bonding machine eutectic straight arm welding head die bonding machine sot sod patch equipment Product Description Product advantages This is a high-speed thermal bonder designed for ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Bsi-CCD Wafer Laser Annealing Equipment for Precision Energy Control
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3085.

Advanced Bsi-CCD Wafer Laser Annealing Equipment for Precision Energy Control Open Details in New Window [Dec 13, 2025]

Bsi-CCD Wafer Dopant Laser Annealing Equipment Precise Energy Density Control Product Description Product Features The first in China, 8 inch mass production equipment Precise energy density control UV laser with ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Precision Positioning Equipment for PCBA and IC Wafers
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3086.

Advanced Precision Positioning Equipment for PCBA and IC Wafers Open Details in New Window [Dec 13, 2025]

Product Description Brief Description The equipment can realize automatic loading and unloading for stacked FPC, automatic positioning and marking, automatic code reading and proofreading, automatic transfer of ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Laser Processing Equipment for Silicon Carbide Wafers
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3087.

Advanced Laser Processing Equipment for Silicon Carbide Wafers Open Details in New Window [Dec 13, 2025]

Customization Silicon Carbide Wafer Laser Processing machine factory Product Description Standard Features Computer Control, Windows OS CCD visual positioning system Servo Motor UPS and voltage stabilizer ESD ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Laser Grooving Cutting Equipment with Humanized Operation Design to Improve User Experience
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3088.

Laser Grooving Cutting Equipment with Humanized Operation Design to Improve User Experience Open Details in New Window [Dec 13, 2025]

Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion platform Equipped with special customized laser head, which ensures high cutting quality and low heat ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Speed Automatic Die Attach Equipment for Precision Bonding
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3089.

High-Speed Automatic Die Attach Equipment for Precision Bonding Open Details in New Window [Dec 13, 2025]

Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Quality Laser Grooving Cutting Equipment Equipped with Special Customized Laser Head
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3090.

High Quality Laser Grooving Cutting Equipment Equipped with Special Customized Laser Head Open Details in New Window [Dec 13, 2025]

High Quality Laser Grooving Cutting Equipment Equipped with Special Customized Laser Head Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.