Jiangsu Profile
Product List
117076. Picosecond High-Precision Laser Cutting & Splitting Machine for Vertical Neat Ceramic Cuts 
[Sep 29, 2026]
[Sep 29, 2026] Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...
117077. Picosecond Crack-Free Laser Cutting & Splitting Machine for Ceramic Dicing [Sep 29, 2026]
[Sep 29, 2026] Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...
117078. Picosecond Low-Stress Laser Cutting & Splitting Machine for Fragile Ceramic Structures [Sep 29, 2026]
[Sep 29, 2026] Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...
117079. Picosecond Accurate-Contour Laser Cutting & Splitting Machine for Fine Ceramic Components [Sep 29, 2026]
[Sep 29, 2026] Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...
117080. Picosecond Flawless-Edge Laser Cutting & Splitting Machine for Brittle Ceramic [Sep 29, 2026]
[Sep 29, 2026] Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...
117081. Picosecond Micro-Crack-Free Laser Cutting & Splitting Machine for Ceramic [Sep 28, 2026]
[Sep 28, 2026] Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...
117082. Picosecond Smooth-Finish Laser Cutting & Splitting Machine for Ceramic [Sep 28, 2026]
[Sep 28, 2026] Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...
117083. Picosecond High-Finesse Laser Cutting & Splitting Machine for Ceramic Substrate [Sep 28, 2026]
[Sep 28, 2026] Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...
117084. Picosecond Clean-Cut Laser Cutting & Splitting Machine for Hard Ceramics [Sep 28, 2026]
[Sep 28, 2026] Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...
117085. Picosecond Stable Laser Cutting & Splitting Machine for Consistent Ceramic Machining [Sep 28, 2026]
[Sep 28, 2026] Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...
117086. Picosecond Cold Processing Laser Cutting & Splitting Machine for Smooth Ceramic [Sep 28, 2026]
[Sep 28, 2026] Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...
117087. Picosecond Cold Process Laser Cutting & Splitting Machine for Delicate Ceramic Components [Sep 28, 2026]
[Sep 28, 2026] Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...
117088. Brittle Material Laser Cut Split Machine for Glass and Ceramic Splitting [Sep 28, 2026]
[Sep 28, 2026] Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...
117089. Infrared Picosecond Glass Laser Cutting Machine for High Edge Strength [Sep 25, 2026]
[Sep 25, 2026] Infrared Picosecond Glass Laser Cutting Machine for High Edge Strength CHANXAN picosecond laser cutting equipment delivers professional ultrafast cold processing solutions for precision glass manufacturing. Its core ...
117090. Roll-Sheet China Laser Cutting Machine Transparent Conductive Film Punching [Sep 24, 2026]
[Sep 24, 2026] Picosecond Laser Machinewith Double-Sation for Roll-Sheet Fast Micro-Processing Chanxan provides comprehensive laser solutions for precision processing in the 3C industry, including core techniques such as FPC precision ...
