Jiangsu Profile
Product List
7591. CE Luag 
[Dec 21, 2023]
[Dec 21, 2023] About: Cerium doped lutetium aluminum garnet crystal (Ce:Lu3Al5O12/Ce:LuAG)is a scintillation crystal material with excellent properties,such as higher light yield and energy resolution, fast decay time (70ns), ...
Company: Nanjing Caijing Optoelectronic Technology Co., Ltd.
7592. Nuclear Technology Experiment System Betatron [Jun 27, 2023]
[Jun 27, 2023] Product Description The self-developed small betatron can produce high-energy X-rays up to 7.5 MeV, and the X-ray dose rate is not lower than 66 mGy/min. It has an alternating high-low energy output mode of 2-7.5 ...
Company: Amber Bridge High Tech Material Technology (Jiangsu) Co., Ltd.
7593. Used in Industrial Non-Destructive Testing Betatron [Jun 26, 2023]
[Jun 26, 2023] Product Description The self-developed small betatron can produce high-energy X-rays up to 7.5 MeV, and the X-ray dose rate is not lower than 66 mGy/min. It has an alternating high-low energy output mode of 2-7.5 ...
Company: Amber Bridge High Tech Material Technology (Jiangsu) Co., Ltd.
7594. Bridge Testing China Self-Developed Small Betatron [Jun 26, 2023]
[Jun 26, 2023] Product Description The self-developed small betatron can produce high-energy X-rays up to 7.5 MeV, and the X-ray dose rate is not lower than 66 mGy/min. It has an alternating high-low energy output mode of 2-7.5 ...
Company: Amber Bridge High Tech Material Technology (Jiangsu) Co., Ltd.
7595. 7.5mev X-ray Beam High Energy Portable Betatron [Jun 26, 2023]
[Jun 26, 2023] Product Description The self-developed small betatron can produce high-energy X-rays up to 7.5 MeV, and the X-ray dose rate is not lower than 66 mGy/min. It has an alternating high-low energy output mode of 2-7.5 ...
Company: Amber Bridge High Tech Material Technology (Jiangsu) Co., Ltd.
7596. Langguang Precision X-ray BGA Soldering Inspection, Lithium Battery Electrode Sheet Inspection, LED ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
7597. Langguang Precision X-ray Inspection Machine, Industrial X-ray Inspection, BGA Soldering ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
7598. Langguang Precision X-ray Inspection Machine, Industrial X-ray Inspection, BGA Soldering ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
7599. Langguang Precision X-ray BGA Soldering Inspection, Lithium Battery Electrode Sheet Inspection, LED ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
7600. Langguang Precision X-ray IC Inspection, Mi Inspection, SMT Inspection, False Soldering, Hole ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
7601. Langguang Precision X-ray IC Inspection, Mi Inspection, SMT Inspection, False Soldering, Hole ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
7602. Langguang Precision X-ray Bubble Cold Welding, False Welding, Crack Detection, Diode Detection, ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
7603. Langguang Precision X-ray Bubble Cold Welding, False Welding, Crack Detection, Diode Detection, ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
7604. Langguang Precision X-ray Bubble, False Soldering, Cavity and Tin Connection Detection X-ray ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
7605. Langguang Precision X-ray Bubble, False Soldering, Cavity and Tin Connection Detection X-ray ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
