Jiangsu Profile
Product List
8116. High Quality Longitudinal Multi Rip Saw Machine Cutting Machine for Spc Flooring Production Line 
[May 06, 2026]
[May 06, 2026] Equipment parameters Spindle diameter 80mm Spindle motor 18.5KW Transmission motor 2.2KW Production line speed 15-35 meter/minute Operating voltage 380V, 50Hz Control ...
Company: Hallmark International Group Limited
8117. Diamond Wire Saw Machine for Mono Crystalline Silicon Cutting [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line This product is a specialized processing equipment for cutting semiconductor single-crystal silicon wafers using diamond wire. It can process silicon ...
8118. High Performance Wire Saw Machine for Silicon Cutting [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line This product is a specialized processing equipment for cutting semiconductor single-crystal silicon wafers using diamond wire. It can process silicon ...
8119. Factory Price Wire Saw Machine for Solar Silicon Cutting [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line This product is a specialized processing equipment for cutting semiconductor single-crystal silicon wafers using diamond wire. It can process silicon ...
8120. Diamond Wire Saw Machine for Polysilicon Cutting [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line This product is a specialized processing equipment for cutting semiconductor single-crystal silicon wafers using diamond wire. It can process silicon ...
8121. Precision Wire Saw Machine for Mono Silicon Cutting [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line This product is a specialized processing equipment for cutting semiconductor single-crystal silicon wafers using diamond wire. It can process silicon ...
8122. Automatic Multi Wire Saw Machine for Silicon Ingot Cutting [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line This product is a specialized processing equipment for cutting semiconductor single-crystal silicon wafers using diamond wire. It can process silicon ...
8123. High Quality Cutting Segmented Diamond Saw Blade [Apr 01, 2026]
[Apr 01, 2026] Product Description: DAIMETER SEGMENG WIDTH ARBOR SIZE SEGMENT ...
Company: Jiangsu Yaofeng Tools Co., Ltd.
8124. High Quality Cutting Segmented Diamond Saw Blade for Marble [Apr 01, 2026]
[Apr 01, 2026] Product Description: DAIMETER SEGMENG WIDTH ARBOR SIZE SEGMENT ...
Company: Jiangsu Yaofeng Tools Co., Ltd.
8125. High Quality Granite Cutting Diamond Saw Blade [Apr 01, 2026]
[Apr 01, 2026] Product Description: DAIMETER SEGMENG WIDTH ARBOR SIZE SEGMENT ...
Company: Jiangsu Yaofeng Tools Co., Ltd.
8126. Long-Life Burr-Free Cutting Diamond Circular Saw Blade for PVC Board Cutting [Mar 20, 2026]
[Mar 20, 2026] Product Description Product Description 1.Application:Suitable for cutting new type boards such as PVC, WPC and SPC, as well as medium and high density fiberboards (MDF/HDF). It meets the cutting needs of board ...
8127. Customization Lat Tooth Diamond Circular Saw Blade for MDF Precision Cutting [Mar 20, 2026]
[Mar 20, 2026] Product Description Product Description 1.Application:Suitable for cutting new type boards such as PVC, WPC and SPC, as well as medium and high density fiberboards (MDF/HDF). It meets the cutting needs of board ...
8128. Customize Stable Heat Resistant Board Diamond Circular Saw Blade for Burr-Free Cutting [Mar 20, 2026]
[Mar 20, 2026] Product Description Product Description 1.Application:Suitable for cutting new type boards such as PVC, WPC and SPC, as well as medium and high density fiberboards (MDF/HDF). It meets the cutting needs of board ...
8129. Direct Sales Corrosion Resistant Board Diamond Circular Saw Blade for Burr-Free Cutting [Mar 20, 2026]
[Mar 20, 2026] Product Description Product Description 1.Application:Suitable for cutting new type boards such as PVC, WPC and SPC, as well as medium and high density fiberboards (MDF/HDF). It meets the cutting needs of board ...
8130. Explosive Models High Speed Board Diamond Circular Saw Blade for Burr-Free Cutting [Mar 20, 2026]
[Mar 20, 2026] Product Description Product Description 1.Application:Suitable for cutting new type boards such as PVC, WPC and SPC, as well as medium and high density fiberboards (MDF/HDF). It meets the cutting needs of board ...
