Made-in-china.com

Made-in-Jiangsu.com

Home » Featured Products »

cpu

» Jiangsu Product List

Product List

Barbell Weightlifting Barbell CPU Fixed Barbell

2776.

Barbell Weightlifting Barbell CPU Fixed Barbell Open Details in New Window [Feb 23, 2024]

Product Description Fixed Weight Barbells by Nantong Newone Sports Products Co., Ltd. Casting Polyurethane (CPU) fixed barbells are expertly crafted by Nantong Newone Sports Products Co., Ltd. These barbells are ...

Company: Nantong Newone Sports Products Co., Ltd.

Heatsink CPU Thermal Conductive Silicone Rubber Thermal Insulation Pad

2777.

Heatsink CPU Thermal Conductive Silicone Rubber Thermal Insulation Pad Open Details in New Window [Aug 21, 2024]

1. Product Description Thermal conductive silicone gap pad is specially designed for the purpose of high-performance thermal conductivity. Standard size: 400mm*200mm, according to customer needs to cut the ...

Company: Suzhou Dasen Electronics Material Co., Ltd.

4.0W/Mk Gray Thermal Silicon Paste for CPU and Heatsink

2778.

4.0W/Mk Gray Thermal Silicon Paste for CPU and Heatsink Open Details in New Window [Aug 21, 2024]

1. Product Description Silicone thermal gel with graphene (one component) Graphene reinforced single component precuring heat conducting gel is applied to all ...

Company: Suzhou Dasen Electronics Material Co., Ltd.

Wholesale Silicone Thermal Putty for Cooling PCB/LED/CPU

2779.

Wholesale Silicone Thermal Putty for Cooling PCB/LED/CPU Open Details in New Window [Aug 21, 2024]

1. Product Description Silicone thermal gel with graphene (one component) Graphene reinforced single component precuring heat conducting gel is applied to all ...

Company: Suzhou Dasen Electronics Material Co., Ltd.

Thermal Silicone Conductive Paste for PCB/CPU/LED

2780.

Thermal Silicone Conductive Paste for PCB/CPU/LED Open Details in New Window [Aug 21, 2024]

1. Product Description Silicone thermal gel with graphene (one component) Graphene reinforced single component precuring heat conducting gel is applied to all ...

Company: Suzhou Dasen Electronics Material Co., Ltd.

High Performance Thermal Silicone Conductive Paste for PCB/CPU/LED

2781.

High Performance Thermal Silicone Conductive Paste for PCB/CPU/LED Open Details in New Window [Aug 21, 2024]

1. Product Description Silicone thermal gel with graphene (one component) Graphene reinforced single component precuring heat conducting gel is applied to all ...

Company: Suzhou Dasen Electronics Material Co., Ltd.

Silicone Rubber Thermal Insulation Pad for CPU GPU

2782.

Silicone Rubber Thermal Insulation Pad for CPU GPU Open Details in New Window [Aug 21, 2024]

1. Product Description Thermal conductive silicone gap pad is specially designed for the purpose of high-performance thermal conductivity. Standard size: 400mm*200mm, according to customer needs to cut the ...

Company: Suzhou Dasen Electronics Material Co., Ltd.

Heatsink Thermal Silica Pad CPU Silicone Thermal Insulation Pad

2783.

Heatsink Thermal Silica Pad CPU Silicone Thermal Insulation Pad Open Details in New Window [Aug 21, 2024]

1. Product Description Thermal conductive silicone gap pad is specially designed for the purpose of high-performance thermal conductivity. Standard size: 400mm*200mm, according to customer needs to cut the ...

Company: Suzhou Dasen Electronics Material Co., Ltd.

GPU CPU Heatsink Heat Conductive Silicone Rubber Gap Pad

2784.

GPU CPU Heatsink Heat Conductive Silicone Rubber Gap Pad Open Details in New Window [May 08, 2024]

1. Product Description Thermal conductive silicone gap pad is specially designed for the purpose of high-performance thermal conductivity. Standard size: 400mm*200mm, according to customer needs to cut the ...

Company: Suzhou Dasen Electronics Material Co., Ltd.

CPU GPU LED Adhesive Insulation Thermal Conductive Silicone Pad

2785.

CPU GPU LED Adhesive Insulation Thermal Conductive Silicone Pad Open Details in New Window [May 08, 2024]

1. Product Description Thermal conductive silicone gap pad is specially designed for the purpose of high-performance thermal conductivity. Standard size: 400mm*200mm, according to customer needs to cut the ...

Company: Suzhou Dasen Electronics Material Co., Ltd.

High Performance Aluminum Alloy Cooled Bonded Fin Heat Sink for CPU Processor

2786.

High Performance Aluminum Alloy Cooled Bonded Fin Heat Sink for CPU Processor Open Details in New Window [Jul 31, 2022]

Product Description Aluminum Extruded Profile 1.Alloying Ingredient: 6063/6061. 2.Temper: T3-T8 3.Machining: Cutting, punching, drilling, milling, bending, welding, CNC etc. 4.Finish: ...

Company: Zhenjiang Dongyan Electronics Co., Ltd.

Black Anodizing CPU Heat Sink

2787.

Black Anodizing CPU Heat Sink Open Details in New Window [Jul 21, 2022]

Product Description Aluminum Extruded Profile 1.Alloying Ingredient: 6063/6061. 2.Temper: T3-T8 3.Machining: Cutting, punching, drilling, milling, bending, welding, CNC etc. 4.Finish: ...

Company: Zhenjiang Dongyan Electronics Co., Ltd.

Aluminum Extrusion Process Precision Customized Computer CPU Heat Sink Accessoriesnk

2788.

Aluminum Extrusion Process Precision Customized Computer CPU Heat Sink Accessoriesnk Open Details in New Window [Jul 17, 2022]

Product Description Aluminum Extruded Profile 1.Alloying Ingredient: 6063/6061. 2.Temper: T3-T8 3.Machining: Cutting, punching, drilling, milling, bending, welding, CNC etc. 4.Finish: ...

Company: Zhenjiang Dongyan Electronics Co., Ltd.

Professional OEM/ODM CPU Aluminum Extrusion Heat Sink

2789.

Professional OEM/ODM CPU Aluminum Extrusion Heat Sink Open Details in New Window [Jul 15, 2022]

Product Description Aluminum Extruded Profile 1.Alloying Ingredient: 6063/6061. 2.Temper: T3-T8 3.Machining: Cutting, punching, drilling, milling, bending, welding, CNC etc. 4.Finish: ...

Company: Zhenjiang Dongyan Electronics Co., Ltd.

High Precision OEM Anodized Finish Aluminum Extrusion CPU Heat Sink

2790.

High Precision OEM Anodized Finish Aluminum Extrusion CPU Heat Sink Open Details in New Window [Jul 14, 2022]

Product Description Aluminum Extruded Profile 1.Alloying Ingredient: 6063/6061. 2.Temper: T3-T8 3.Machining: Cutting, punching, drilling, milling, bending, welding, CNC etc. 4.Finish: ...

Company: Zhenjiang Dongyan Electronics Co., Ltd.