Jiangsu Profile
Product List
1726. Fr4 Xpc Cem1 Cem3 Al-Ccl Copper Clad Laminate for PCB 
[Aug 21, 2024]
[Aug 21, 2024] Product description FR-4 copper clad laminated sheet uses glass fiber cloth as substrate material. After being immersed with epoxy resin and then baked into prepreg sheet, several prepreg sheets are then coated with ...
1727. Paper Based Phenolic Resin Copper Clad Laminate Fr1 Xpc [Aug 21, 2024]
[Aug 21, 2024] Product description FR-4 copper clad laminated sheet uses glass fiber cloth as substrate material. After being immersed with epoxy resin and then baked into prepreg sheet, several prepreg sheets are then coated with ...
1728. Kb/L Logo Fr1 Phenolic Resin Paper Based Copper Clad Laminate [Aug 21, 2024]
[Aug 21, 2024] Product description FR-4 copper clad laminated sheet uses glass fiber cloth as substrate material. After being immersed with epoxy resin and then baked into prepreg sheet, several prepreg sheets are then coated with ...
1729. Fr4 Copper Clad Lamiante for Printed Circuit Board [Aug 21, 2024]
[Aug 21, 2024] Product description FR-4 copper clad laminated sheet uses glass fiber cloth as substrate material. After being immersed with epoxy resin and then baked into prepreg sheet, several prepreg sheets are then coated with ...
1730. Glass Epoxy Fr4 Copper Clad Laminate for Printed Circuit Board [Aug 21, 2024]
[Aug 21, 2024] Product description FR-4 copper clad laminated sheet uses glass fiber cloth as substrate material. After being immersed with epoxy resin and then baked into prepreg sheet, several prepreg sheets are then coated with ...
1731. A Grade Fr4 Ccl Copper Clad Laminate with Good Price [Aug 21, 2024]
[Aug 21, 2024] Product description FR-4 copper clad laminated sheet uses glass fiber cloth as substrate material. After being immersed with epoxy resin and then baked into prepreg sheet, several prepreg sheets are then coated with ...
1732. Fr1 Cem1 Cem3 Xpc Ccl Copper Clad Laminate [Aug 21, 2024]
[Aug 21, 2024] Product description FR-4 copper clad laminated sheet uses glass fiber cloth as substrate material. After being immersed with epoxy resin and then baked into prepreg sheet, several prepreg sheets are then coated with ...
1733. Fr4 Copper Clad Laminate UL 94-Vo 1.0mm 35/00um [Aug 21, 2024]
[Aug 21, 2024] Product description FR-4 copper clad laminated sheet uses glass fiber cloth as substrate material. After being immersed with epoxy resin and then baked into prepreg sheet, several prepreg sheets are then coated with ...
1734. Fr1 1020*1220mm Paper Base Phenolic Resin Copper Clad Lamiante [Aug 21, 2024]
[Aug 21, 2024] Product description FR-4 copper clad laminated sheet uses glass fiber cloth as substrate material. After being immersed with epoxy resin and then baked into prepreg sheet, several prepreg sheets are then coated with ...
1735. Oxygen-Free Copper for Renewable Energy, Hehong Hhp Copper Cw008A Cu-of Hollow Conductor with ... [Jul 16, 2025]
[Jul 16, 2025] HHP COPPER HEHONG HHP COPPER GANSU HEHONG hehong hhp - Elevate your copper needs with the unrivaled expertise of Gansu Hehong, where top-tier HHP Copper embodies innovation and excellence. Why you choose HHP COPPER? ...
Company: Gansu Hehong New Materials Co., Ltd.
1736. Hot Sale Thermal Conductivity 18 Micron Copper Foil Aluminum Base Copper Clad Laminate for Circuit [Aug 21, 2024]
[Aug 21, 2024] Product description FR-4 copper clad laminated sheet uses glass fiber cloth as substrate material. After being immersed with epoxy resin and then baked into prepreg sheet, several prepreg sheets are then coated with ...
1737. thermal conductivity copper foil aluminum base copper clad laminate for circuit board [Aug 21, 2024]
[Aug 21, 2024] Product description FR-4 copper clad laminated sheet uses glass fiber cloth as substrate material. After being immersed with epoxy resin and then baked into prepreg sheet, several prepreg sheets are then coated with ...
1738. Top Sale Thermal Conductivity 18 Micron Copper Foil Aluminum Base Copper Clad Laminate for Circuit [Aug 21, 2024]
[Aug 21, 2024] Product description FR-4 copper clad laminated sheet uses glass fiber cloth as substrate material. After being immersed with epoxy resin and then baked into prepreg sheet, several prepreg sheets are then coated with ...
1739. Top Sale Thermal Conductivity 18 Micron Copper Foil Aluminum Base Copper Clad Laminate for Circuit ... [Aug 21, 2024]
[Aug 21, 2024] Product description FR-4 copper clad laminated sheet uses glass fiber cloth as substrate material. After being immersed with epoxy resin and then baked into prepreg sheet, several prepreg sheets are then coated with ...
1740. 1.6mm 35um Copper Foil Aluminum Copper Clad Laminate for LED PCB [Aug 21, 2024]
[Aug 21, 2024] Product description FR-4 copper clad laminated sheet uses glass fiber cloth as substrate material. After being immersed with epoxy resin and then baked into prepreg sheet, several prepreg sheets are then coated with ...
