Jiangsu Profile
Product List
47086. Dk7763A Wire Electrical Discharge Machine Wire Cut EDM Machine Wire EDM Machine 
[Aug 27, 2025]
[Aug 27, 2025] Product Description A Series--High Precision Wire Cut EDM Machine With Stepper Motor Specification 1.Machine Features: •Accuracy:0.003--0.004 •Roughness:1.0μmRa •Processing ...
Company: Uslugi Tech Co., Ltd.
47087. Unitec 6040 6090 1070 CNC Oscillating Knife Mark Pen Cutting Machine Cardboard Corrugated Carton ... [Jun 13, 2025]
[Jun 13, 2025] Detailed Photos Product Parameters XYZ Travel Size 1000X700X150mm Max Working Size 1000X700X120mm Table Size 1000X700mm Transmission Type XY rack/Z ball screw Guide Rail Linear Guide Table ...
Company: Nanjing Unitec Technology Co., Ltd.
47088. Wafer Dicing Machine Abrasive Wire Cutting Machine for Semiconductive Material, Graphite [Jun 10, 2025]
[Jun 10, 2025] Product Description Abrasive Wire Cutting Machine -- Used for slicing and cutting various non-metallic materials Our company independently develops technology and adopts the world's leading circular structure ...
Company: Uslugi Tech Co., Ltd.
47089. High Precision Wafer Dicing Machine for Nonmetal Materials [Jun 10, 2025]
[Jun 10, 2025] Product Description Abrasive Wire Cutting Machine -- Used for slicing and cutting various non-metallic materials Our company independently develops technology and adopts the world's leading circular structure ...
Company: Uslugi Tech Co., Ltd.
47090. High Precision Semiconductive Material Cutting Machine Abrasive Wire Cutting Machine [Jun 10, 2025]
[Jun 10, 2025] Product Description Abrasive Wire Cutting Machine -- Used for slicing and cutting various non-metallic materials Our company independently develops technology and adopts the world's leading circular structure ...
Company: Uslugi Tech Co., Ltd.
47091. Abrasive Wire Cutting Machine Wafer Dicing Saw Machine [Jun 10, 2025]
[Jun 10, 2025] Product Description Abrasive Wire Cutting Machine -- Used for slicing and cutting various non-metallic materials Our company independently develops technology and adopts the world's leading circular structure ...
Company: Uslugi Tech Co., Ltd.
47092. Wafer Dicing Machine Abrasive Wire Cutting Machine for Semiconductive Material, Nonmetal Materials [Jun 10, 2025]
[Jun 10, 2025] Product Description Abrasive Wire Cutting Machine -- Used for slicing and cutting various non-metallic materials Our company independently develops technology and adopts the world's leading circular structure ...
Company: Uslugi Tech Co., Ltd.
47093. Winding Type Abrasive Wire Cutting Machine Sx350 [Jun 10, 2025]
[Jun 10, 2025] Product Description Abrasive Wire Cutting Machine -- Used for slicing and cutting various non-metallic materials Our company independently develops technology and adopts the world's leading circular structure ...
Company: Uslugi Tech Co., Ltd.
47094. Abrasive Wire Cutting Machine for Wafer [Jun 10, 2025]
[Jun 10, 2025] Product Description Abrasive Wire Cutting Machine -- Used for slicing and cutting various non-metallic materials Our company independently develops technology and adopts the world's leading circular structure ...
Company: Uslugi Tech Co., Ltd.
47095. Higher Accuracy Ceramic Wire Cutting Machine Semiconductive Material Cutting Machine. [Jun 10, 2025]
[Jun 10, 2025] Product Description Abrasive Wire Cutting Machine -- Used for slicing and cutting various non-metallic materials Our company independently develops technology and adopts the world's leading circular structure ...
Company: Uslugi Tech Co., Ltd.
47096. Abrasive Wire Cutting Machine for Semi-Conductor Graphite Cutting Machine [Jun 10, 2025]
[Jun 10, 2025] Product Description Abrasive Wire Cutting Machine -- Used for slicing and cutting various non-metallic materials Our company independently develops technology and adopts the world's leading circular structure ...
Company: Uslugi Tech Co., Ltd.
47097. Abrasive Wire Cutting Machine for Nonmetal Materials, Graphite, Acrylic, Silicon Carbide [Jun 10, 2025]
[Jun 10, 2025] Product Description Abrasive Wire Cutting Machine -- Used for slicing and cutting various non-metallic materials Our company independently develops technology and adopts the world's leading circular structure ...
Company: Uslugi Tech Co., Ltd.
47098. High Precision Wafer Dicing Saw Abrasive Wire Cutting Machine [Jun 10, 2025]
[Jun 10, 2025] Product Description Abrasive Wire Cutting Machine -- Used for slicing and cutting various non-metallic materials Our company independently develops technology and adopts the world's leading circular structure ...
Company: Uslugi Tech Co., Ltd.
47099. Wafer Dicing Saw Machine Abrasive Wire Cutting Machine [Jun 10, 2025]
[Jun 10, 2025] Product Description Abrasive Wire Cutting Machine -- Used for slicing and cutting various non-metallic materials Our company independently develops technology and adopts the world's leading circular structure ...
Company: Uslugi Tech Co., Ltd.
47100. Abrasive Wire Cutting Machine for Ceramics, Epoxy Board, Ferrite, Semiconductive Materials [Jun 10, 2025]
[Jun 10, 2025] Product Description Abrasive Wire Cutting Machine -- Used for slicing and cutting various non-metallic materials Our company independently develops technology and adopts the world's leading circular structure ...
Company: Uslugi Tech Co., Ltd.
