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4651. 24VDC Smart Sensor Pressure Transmitter with Customization Optional 
[Dec 24, 2025]
[Dec 24, 2025] HPM240 Intelligent Digital Display Pressure Transmitter is a multifunctional digital instrument. It adopts proven and reliable technology of silicon sensor and it is designed with advanced SCM(single chip ...
4652. High-Precision Automatic Die Bonding Equipment for Semiconductor Production [Dec 23, 2025]
[Dec 23, 2025] Fully Automatic Die Bonding Machine System manufacturer Product Description This series of soft solder die bonding machines is the most accurate and fastest 8-inch (downward compatible with 6-inch) soft solder die ...
4653. High Efficiency Automatic PCB and PCBA Manufacturing Machine [Dec 19, 2025]
[Dec 19, 2025] Product Description PCB/PCBA Online Cutting Machine is used for the cutting and separating of small and multi-connected PCBs, such as those used in mobile phones, digital cameras, GPS devices, PDAs, 5G ...
4654. Hair Clipper Zro2 Zirconia Ceramic Trimmer Blade [Dec 17, 2025]
[Dec 17, 2025] All these zirconia ceramic clipper blades are famous for their exceptional wear-resistance, high hardness, lightweight, longer service life than metal blades and more high quality cosmetic. ceramic blade helps the ...
4655. High Quality Ion Implanter Semiconductor Material Small Implanter [Dec 13, 2025]
[Dec 13, 2025] Product Description 1. Product overview Ion implanter is one of the high pressure small accelerators with the largest number of applications. It is the ion source to obtain the required ions, after the ...
4656. Innovation Technologies Vacuum Ion Implantation System [Dec 13, 2025]
[Dec 13, 2025] Innovation Technologies Vacuum Ion Implantation System Product Description 1. Product overview Ion implanter is one of the high pressure small accelerators with the largest number of applications. It is the ion ...
4657. Automatic PCB/PCBA Online Cutting Machine Cutting PVC Board/Plastic Board/PMMA Board [Dec 13, 2025]
[Dec 13, 2025] Automatic PCB/PCBA Online Cutting Machine Cutting PVC Board/Plastic Board/PMMA Board Product Description PCB/PCBA Online Cutting Machine is used for the cutting and separating of small and multi-connected ...
4658. Equipment Factory Rapid Wire Bonding Machine for Production Line [Dec 13, 2025]
[Dec 13, 2025] Equipment factory Rapid wire bonding machine for production line Product Description Technical Specifications: Wire Bonding Capability Ultra-fine Pitch Gold Wire Bonding: 35 μm Inline Bond Pad Pitch Wire ...
4659. Automatic Semiconductor Soft Solder Bonding Die Attach Solution SD800 Die Bonder [Dec 13, 2025]
[Dec 13, 2025] Fully Automatic Die Bonding Machine System manufacturer Product Description Revolutionize Your Production with the SD800 Fully Automatic Die Bonding Machine In the fast-paced world of semiconductor manufacturing, ...
4660. High Quality 0.8 to 25mm Chip Epoxy Die Bonder TCP/IP Factory Price [Dec 13, 2025]
[Dec 13, 2025] Die Bonder Chip Bonding Equipment (Die Bonder) Also known as a die bonder, it is a semiconductor packaging device used to mount and attach chips onto substrate packages. It employs various methods such as using nozzles ...
4661. Precision Automatic Eutectic Flip Chip Die Bonding Machine for IC Packaging [Dec 13, 2025]
[Dec 13, 2025] Die Bonder Chip Bonding Equipment (Die Bonder) Also known as a die bonder, it is a semiconductor packaging device used to mount and attach chips onto substrate packages. It employs various methods such as using nozzles ...
4662. Automatic Die Bonding Flip Chip and Die Attach Bonder for Soic/So/Qfn/BGA/LGA [Dec 13, 2025]
[Dec 13, 2025] Flip chip die bonder DA1201FC Flip Chip and Die AttachX/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially designed for flip chip devices with low pin ...
4663. Automatic High Speed Epoxy Die Bonder Machine Manufacturer [Dec 13, 2025]
[Dec 13, 2025] Fully Automatic Die Bonding Machine System manufacturer Product Description Ultra High-Speed Silver Paste Die Bonder Unmatched Speed and Precision for Modern Semiconductor Assembly Introducing our fully automatic ...
4664. High-Speed Wire Bonding Machine for Production Line [Dec 13, 2025]
[Dec 13, 2025] High-Speed Wire Bonding Machine for Production Line Product Description High-Performance Automatic Wire Bonder This equipment is a state-of-the-art automatic wire bonding machine designed for high-mix, high-volume ...
4665. Automatic LED/IC Flip Chip Die Bonding Machine [Dec 13, 2025]
[Dec 13, 2025] HMLA-S platform is an off-line automatic micro assembly system developed by the company, which can be equipped with nozzle heating module, material tray/wafer placing plate, ultrasonic module, laser heating module, UV ...
