Jiangsu Profile
Product List
32386. Outdoor Highway Waterproof IP66 30 50 100 150 200W Cheap Price Thin LED Street Light LED Road Light ... 
[Jun 10, 2025]
[Jun 10, 2025] Outdoor Highway Waterproof IP66 30 50 100 150 200W Cheap Price Thin LED Street Light LED Road Light LED Project Light Product Type Led Street Light Power 30W/50W/100W/150W/200W/250W LED Chip COB Chip Input ...
32387. High Light Efficiency OEM/ODM 5 Years Warrantywaterproof IP67 Ik08 1200W High Mast Modules Outdoor ... [Jan 17, 2025]
[Jan 17, 2025] Height From 15 m to 45 m Apply in Highway, freeway, Airport ,seaport,plaza,stadium ,square,highway,street way etc Shape Conical, octagonal, square, cylinder Material Usually Q345B/A572, Q235B/A36, Q460 ,ASTM573 ...
32388. Highway Driving Car Security Outdoor Modular High Pole LED Floodlight 500W 600W 400W 300W 200W 100W ... [Jan 17, 2025]
[Jan 17, 2025] Height From 15 m to 45 m Apply in Highway, freeway, Airport ,seaport,plaza,stadium ,square,highway,street way etc Shape Conical, octagonal, square, cylinder Material Usually Q345B/A572, Q235B/A36, Q460 ,ASTM573 ...
32389. Customized High Quality Outdoor High Mast Lighting Pole Hot DIP Galvanized 18m High Mast Lamp Poles [Jan 17, 2025]
[Jan 17, 2025] Height From 15 m to 45 m Apply in Highway, freeway, Airport ,seaport,plaza,stadium ,square,highway,street way etc Shape Conical, octagonal, square, cylinder Material Usually Q345B/A572, Q235B/A36, Q460 ,ASTM573 ...
32390. The Domestically Produced Submicron Chip Laminating Machine Adopts Modular Design [Dec 26, 2023]
[Dec 26, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
32391. Domestic Optical Testing Equipment with Intelligent Defect Classification 3ng Buffer Track [Dec 20, 2023]
[Dec 20, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
32392. Domestic Self-Developed Solidification Machine with Integrated Hot Pressing and Bonding Function [Dec 19, 2023]
[Dec 19, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
32393. High Precision Chip Bonding Equipment Applied in The Field of Optical Communication [Dec 18, 2023]
[Dec 18, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
32394. Fully Automatic Submicron Level Eutectic Laser Heating Can Adapt to Small Devices [Dec 15, 2023]
[Dec 15, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
32395. Manual Process Eutectic Equipment with Sub Micron Level Mounting Accuracy [Dec 14, 2023]
[Dec 14, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
32396. Flexible Selection of Multiple Feeding Methods for Domestic Crystal Solidification Machine Equipment [Dec 12, 2023]
[Dec 12, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
32397. Used High Quality Speedline Micron Level Epoxy Die Bonding /Attach Machine [Dec 11, 2023]
[Dec 11, 2023] Product Description The DW9621 Series of die bonders is a high-speed machine designed for high-bonding force applications. With a self-developed force control system, it achieves high-precision die bonding with an ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
32398. Customizable Development of High-Precision Eutectic Machines with Closed-Loop Force Control [Dec 11, 2023]
[Dec 11, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
32399. IC Chip Packaging Die Bonding Machine Supports COB/Coc/Cos Packaging Process [Dec 11, 2023]
[Dec 11, 2023] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
32400. High End Die Bonder Equipment to Assist in Semiconductor Packaging [Dec 11, 2023]
[Dec 11, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
