Jiangsu Profile
Product List
2071. Submicron Placement Accuracy Die Bonder 
[Oct 17, 2023]
[Oct 17, 2023] Product Description The MicroStar Series is a series of leading multifunctional Die Attach Equipments with high efficiency (15-35s/pcs) and high precision (±0.5~±3μm) . This series serves functions ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
2072. Precision Epoxy Die Bonding Machine China [Oct 11, 2023]
[Oct 11, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
2073. Photonics Packaging Eutectic Bonding Machine Die Attach Equipment [Oct 11, 2023]
[Oct 11, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
2074. Automatic Multi Die Chip Epoxy Bonding Machine [Oct 09, 2023]
[Oct 09, 2023] Product Description The DW9621 Series of die bonders is a high-speed machine designed for high-bonding force applications. With a self-developed force control system, it achieves high-precision die bonding with an ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
2075. COB (Chip on Board) Die Attach Epoxy Machine [Oct 09, 2023]
[Oct 09, 2023] Product Description The DW9621 Series of die bonders is a high-speed machine designed for high-bonding force applications. With a self-developed force control system, it achieves high-precision die bonding with an ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
2076. China Semi-Automatically Die Bonding Machine [Oct 09, 2023]
[Oct 09, 2023] Product Description The DW9621 Series of die bonders is a high-speed machine designed for high-bonding force applications. With a self-developed force control system, it achieves high-precision die bonding with an ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
2077. Bozhon Semiconductor Die Bonding Machine China Equipment [Oct 09, 2023]
[Oct 09, 2023] Product Description The EG9921 is a fully automatic sub-micron SMT machine. Its unique laser heating technology can heat the top of the substrate in a small area, achieving rapid heating of the part surface and ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
2078. High Precision Soldering Machine Die Bonding [Oct 09, 2023]
[Oct 09, 2023] Product Description The MicroStar Series is a series of leading multifunctional Die Attach Equipments with high efficiency (15-35s/pcs) and high precision (±0.5~±3μm) . This series serves functions ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
2079. High Precision Die Bonding Machine [Oct 09, 2023]
[Oct 09, 2023] Product Description The EH9721 has functions such as rail-to-rail loading and unloading, making it more widely applicable and suitable for mass production of products. Detailed Photos High Precision: ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
2080. High Power Lasers Epoxy Machine China [Oct 09, 2023]
[Oct 09, 2023] Product Description The DW9621 Series of die bonders is a high-speed machine designed for high-bonding force applications. With a self-developed force control system, it achieves high-precision die bonding with an ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
2081. Submikron Semiconductor Die Bonding & Die Solder Machines [Oct 09, 2023]
[Oct 09, 2023] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
2082. IC Packaging Die Attach Epoxy Machine China Manufacturer [Oct 09, 2023]
[Oct 09, 2023] Product Description The EF9621 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
2083. Microwave Power Amplifier Eutectic Machine [Oct 09, 2023]
[Oct 09, 2023] Product Description The EG9921 is a fully automatic sub-micron SMT machine. Its unique laser heating technology can heat the top of the substrate in a small area, achieving rapid heating of the part surface and ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
2084. Free Sample! Huahao RFID Manufacturer Customized NFC 13.56MHz Hf Tags [Jul 13, 2023]
[Jul 13, 2023] Free Sample! HUAHAO RFID Manufacturer Customized NFC 13.56Mhz HF Tags Product Name NFC Tag Mode Number All Model, Customized Material PET, Coated paper, Customized Size 25mm diameters (Can be customized other ...
2085. Free Sample! Huahao RFID Manufacturer Customized 13.56MHz NXP NFC Tags [Jul 13, 2023]
[Jul 13, 2023] Free Sample! HUAHAO RFID Manufacturer Customized 13.56Mhz NXP NFC Tags Product Name NFC Tag Mode Number All Model, Customized Material PET, Coated paper, Customized Size 25mm diameters (Can be customized ...
