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High-Precision Thick Film Furnace for Superior Thermal Control
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223461.

High-Precision Thick Film Furnace for Superior Thermal Control

Open Details in New Window [May 11, 2026]

Product Description Category Specification Temperature Range RT (Room Temperature) to 1100°C Temperature Uniformity Better than ±2°C across the furnace Network Belt Speed 20-150 mm/min ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Laser Grooving System for Low-K CMOS Wafers
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223462.

High-Precision Laser Grooving System for Low-K CMOS Wafers

Open Details in New Window [May 11, 2026]

Low-K/CMOS Wafer Laser Grooving Cutting Machine Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion platform. Equipped with special customized laser head, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Precision Vacuum Oven for Reliable Thermal Testing Solutions
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223463.

Precision Vacuum Oven for Reliable Thermal Testing Solutions

Open Details in New Window [May 11, 2026]

Product Description Application introduction: Widely used in scientific research and production units such as aviation, aerospace, petroleum, chemical industry, shipbuilding, electronics, communications, etc., ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Fully Automatic Vacuum Oven for Efficient Semiconductor Drying
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223464.

Fully Automatic Vacuum Oven for Efficient Semiconductor Drying

Open Details in New Window [May 11, 2026]

Product Description Product Usage: It is used in semiconductor and pan-semiconductor processes such as low-temperature baking, drying, water removal, curing, and debinding in a vacuum environment. Features: 1. ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Temperature 550 °C Ceramic Hot Air Drying Oven
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223465.

High-Temperature 550 °C Ceramic Hot Air Drying Oven

Open Details in New Window [May 11, 2026]

Product Description Hot air circulation rubber discharge furnace (degreasing furnace) The hot air circulation dispensing furnace is specifically designed for the dispensing process of ceramics using various molding ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Vertical Furnace for Efficient Sic Coating Solutions
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223466.

Advanced Vertical Furnace for Efficient Sic Coating Solutions

Open Details in New Window [May 11, 2026]

Product Description Product Usage: This product is mainly oriented to the field of SIC power device manufacturing. The SIC/PI composite film is carbonized at 600-1050°C in a nitrogen atmosphere. During the ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Performance Rapid Heating Furnace for Superior Sintering Results
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223467.

High-Performance Rapid Heating Furnace for Superior Sintering Results

Open Details in New Window [May 11, 2026]

Product Description The FMJ series high-temperature box furnace adopts imported inorganic vacuum adsorption ceramic fiber furnace, multi-layer insulation material insulation, fast heating, strong thermal shock ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Efficiency Integrated Furnace for Premium Ceramic Fiber Manufacturing
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223468.

High-Efficiency Integrated Furnace for Premium Ceramic Fiber Manufacturing

Open Details in New Window [May 11, 2026]

Product Description The mesh belt type adhesive discharge sintering furnace is applied to the adhesive discharge sintering of thick film circuits for ceramic substrate printing; Drying and calcination of metal ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Streamlined Laser Deflashing Solutions for Enhanced Production Efficiency
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223469.

Streamlined Laser Deflashing Solutions for Enhanced Production Efficiency

Open Details in New Window [May 11, 2026]

Product Description Product Features Laser scanning and vaporization for deflashing. No chemical softening or high-pressure water jetting required Optical shaping technology, ensuring no damage to tube pins.Improving ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Fiber Laser Cutting Machine with Precision Gear Rack Technology
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223470.

Advanced Fiber Laser Cutting Machine with Precision Gear Rack Technology

Open Details in New Window [May 11, 2026]

Effectively Open Fiber Laser Cutting Machine Adopts Gear Rack Transmission Structure Product Description MPS-3015D series laser cutting machine adopts gear rack transmission structure, effectively ensure the running ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Precision Laser Trimming Tool for Efficient Circuit Board Repairs
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223471.

Precision Laser Trimming Tool for Efficient Circuit Board Repairs

Open Details in New Window [May 11, 2026]

Product Description Product Features Custom C02 or UV/Green picosecond laser Self-developed software and processing technology that meets different process requirements Glue removal and window opening Support ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Servo-Controlled Laser Cutters for Metal and Wood
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223472.

Advanced Servo-Controlled Laser Cutters for Metal and Wood

Open Details in New Window [May 11, 2026]

Product Description Product Introduction: The MPS-D series laser cutting machine is a high configuration and high-performance fiber laser cutting machine tailored for the metal cutting and forming market. The MPS-D ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Industrial Fiber Laser Cutting Machine for Metals
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223473.

Advanced Industrial Fiber Laser Cutting Machine for Metals

Open Details in New Window [May 11, 2026]

Fiber Laser Cutting Machine for Various Alloy Materials Pipe Product Description Product Introduction: The MPS-D series laser cutting machine is a high configuration and high-performance fiber laser cutting machine ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Laser Engraving Machine for Custom Gear Production
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223474.

High-Precision Laser Engraving Machine for Custom Gear Production

Open Details in New Window [May 11, 2026]

Gears / Shafts / Bearings / Clutch / Metal Fiber Laser Marking Machine Product Description Brief Description 1. Various metal materials, part of non-metal materials. 2. The fiber optic laser oscillator marker has ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision UV Laser Engraving System for Circuit Boards
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223475.

High-Precision UV Laser Engraving System for Circuit Boards

Open Details in New Window [May 11, 2026]

Product Description Brief Description Applicable for the packaged IC marking of DIP, QFN and BGA. Features: 1. Fully-automatic loading and unloading from hanging basket to hanging basket, stable laser ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Laser Engraver for Custom Circuit Board Design
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223476.

High-Precision Laser Engraver for Custom Circuit Board Design

Open Details in New Window [May 11, 2026]

UV/CO2 Laser Marking Machine on The Rigid and Flexible Printed Circuit Board PCBA Product Description Brief Description Applicable for the digital products, wearable devices, automobile PCBA, mobile phone PCBA, FPC ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Versatile Green Laser Engraving Machine for Artistic Designs
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223477.

Versatile Green Laser Engraving Machine for Artistic Designs

Open Details in New Window [May 11, 2026]

Green Laser Marking Machine On Mobile Digital Products/Copper Foil/FPC Steel Sheet/Pi/Cvl/Barcode/Qr Codel Product Description Brief Description The equipment can realize automatic loading and unloading for ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision CO2 Laser Engraver for Custom Food Labels
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223478.

High-Precision CO2 Laser Engraver for Custom Food Labels

Open Details in New Window [May 11, 2026]

Product Description It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision CO2 Laser Engraver for Custom Fabric Art
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223479.

High-Precision CO2 Laser Engraver for Custom Fabric Art

Open Details in New Window [May 11, 2026]

Product Description It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Precision COB Die Bonding Machine for Electronics Production
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223480.

High Precision COB Die Bonding Machine for Electronics Production

Open Details in New Window [May 11, 2026]

Semiconductor High Precision COB Smart Die Bonding Machine with Automatic Dispensing System Product Description Equipment Specifications DIE BONDER SHD8060 Bonding method Eutectic Bonding precision X/Y ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.